Filter Your Search
41 - 50 of 4,306 results
|
82P2821BHG
Renesas Electronics Corporation
|
Check for Price | Yes | Yes | Active | 1.8 V | BIPOLAR | PCM TRANSCEIVER | 1 | INDUSTRIAL | S-PBGA-B640 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 640 | PLASTIC/EPOXY | BGA | BGA640,30X30,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 31 mm | 31 mm | 2.44 mm | RENESAS ELECTRONICS CORP | PBGA | 640 | BHG640 | compliant | NLR | 8542390001 | Renesas Electronics | |||||||
|
82P2284BB
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 1.8 V | BIPOLAR | T-1(DS1) | PCM TRANSCEIVER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B208 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 30 | 208 | PLASTIC/EPOXY | BGA | BGA208,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.97 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 208 | not_compliant | 8542.39.00.01 | BGA-208 | |||||||
|
DS3252+
Maxim Integrated Products
|
Check for Price | Yes | Yes | Obsolete | 3.3 V | BIPOLAR | PCM TRANSCEIVER | 1 | 200 µA | COMMERCIAL | S-PBGA-B144 | e1 | Not Qualified | 3 | 70 °C | 260 | 30 | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 13 mm | 13 mm | 1.76 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 144 | compliant | EAR99 | 8542.39.00.01 | 13 X 13 MM, 1 MM PITCH, CSBGA-144 | ||||||||
|
DS3251+
Maxim Integrated Products
|
Check for Price | Yes | Yes | Obsolete | 3.3 V | BIPOLAR | PCM TRANSCEIVER | 1 | 120 µA | COMMERCIAL | S-PBGA-B144 | e1 | Not Qualified | 3 | 70 °C | 260 | 30 | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 13 mm | 13 mm | 1.76 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 144 | compliant | EAR99 | 8542.39.00.01 | 13 X 13 MM, 1 MM PITCH, CSBGA-144 | ||||||||
|
XR-C277-FL
Exar Corporation
|
Check for Price | Yes | Obsolete | 6.3 V | BIPOLAR | T-1(DS1) | 1.544 Gbps | PCM TRANSCEIVER | 1 | 13 mA | INDUSTRIAL | R-GDIP-T16 | e3 | Not Qualified | 85 °C | -40 °C | 16 | CERAMIC, GLASS-SEALED | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 20.2438 mm | 5.08 mm | EXAR CORP | DIP | 16 | unknown | 8542.39.00.01 | DIP, DIP16,.3 | ||||||||||
|
IDT82P2281PFG8
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 3.3 V | BIPOLAR | T-1(DS1) | PCM TRANSCEIVER | T-1(DS1) | 1 | INDUSTRIAL | S-PQFP-G80 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 1.6 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 80 | compliant | EAR99 | 8542.39.00.01 | GREEN, TQFP-80 | ||||||
|
IDT82P2288BB
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 1.8 V | BIPOLAR | T-1(DS1) | PCM TRANSCEIVER | 1 | INDUSTRIAL | S-PBGA-B256 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 3.5 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 256 | not_compliant | EAR99 | 8542.39.00.01 | PLASTIC, BGA-256 | |||||||
|
IDT82P2284BBG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 1.8 V | BIPOLAR | T-1(DS1) | PCM TRANSCEIVER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B208 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | BGA | BGA208,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.97 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 208 | compliant | EAR99 | 8542.39.00.01 | GREEN, PLASTIC, BGA-208 | ||||||||
|
IDT82P2282PF8
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 3.3 V | BIPOLAR | T-1(DS1) | PCM TRANSCEIVER | T-1(DS1) | 1 | INDUSTRIAL | R-PQFP-G100 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 20 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn85Pb15) | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 1.6 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 100 | not_compliant | 8542.39.00.01 | TQFP-100 | |||||||
|
XR-T5620P
Exar Corporation
|
Check for Price | No | Obsolete | 5.1 V | BIPOLAR | T-1(DS1) | 2.37 Gbps | T-148C(DS148C) | 30 mA | INDUSTRIAL | R-PDIP-T18 | e0 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | EXAR CORP | unknown | 8542.39.00.01 | DIP, DIP18,.3 |