Parametric results for: Digital Transmission Interfaces

Filter Your Search

41 - 50 of 4,306 results

|
-
-
-
-
-
-
-
-
-
-
-
Sorted By: Technology
Select parts from the table below to compare.
Compare
Compare
82P2821BHG
Renesas Electronics Corporation
Check for Price Yes Yes Active 1.8 V BIPOLAR PCM TRANSCEIVER 1 INDUSTRIAL S-PBGA-B640 e1 Not Qualified 3 85 °C -40 °C 260 30 640 PLASTIC/EPOXY BGA BGA640,30X30,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 31 mm 31 mm 2.44 mm RENESAS ELECTRONICS CORP PBGA 640 BHG640 compliant NLR 8542390001 Renesas Electronics
82P2284BB
Integrated Device Technology Inc
Check for Price No No Obsolete 1.8 V BIPOLAR T-1(DS1) PCM TRANSCEIVER T-1(DS1) 1 INDUSTRIAL S-PBGA-B208 e0 Not Qualified 3 85 °C -40 °C 225 30 208 PLASTIC/EPOXY BGA BGA208,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 17 mm 17 mm 1.97 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 208 not_compliant 8542.39.00.01 BGA-208
DS3252+
Maxim Integrated Products
Check for Price Yes Yes Obsolete 3.3 V BIPOLAR PCM TRANSCEIVER 1 200 µA COMMERCIAL S-PBGA-B144 e1 Not Qualified 3 70 °C 260 30 144 PLASTIC/EPOXY BGA BGA144,12X12,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 13 mm 13 mm 1.76 mm MAXIM INTEGRATED PRODUCTS INC BGA 144 compliant EAR99 8542.39.00.01 13 X 13 MM, 1 MM PITCH, CSBGA-144
DS3251+
Maxim Integrated Products
Check for Price Yes Yes Obsolete 3.3 V BIPOLAR PCM TRANSCEIVER 1 120 µA COMMERCIAL S-PBGA-B144 e1 Not Qualified 3 70 °C 260 30 144 PLASTIC/EPOXY BGA BGA144,12X12,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 13 mm 13 mm 1.76 mm MAXIM INTEGRATED PRODUCTS INC BGA 144 compliant EAR99 8542.39.00.01 13 X 13 MM, 1 MM PITCH, CSBGA-144
XR-C277-FL
Exar Corporation
Check for Price Yes Obsolete 6.3 V BIPOLAR T-1(DS1) 1.544 Gbps PCM TRANSCEIVER 1 13 mA INDUSTRIAL R-GDIP-T16 e3 Not Qualified 85 °C -40 °C 16 CERAMIC, GLASS-SEALED DIP DIP16,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 7.62 mm 20.2438 mm 5.08 mm EXAR CORP DIP 16 unknown 8542.39.00.01 DIP, DIP16,.3
IDT82P2281PFG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 3.3 V BIPOLAR T-1(DS1) PCM TRANSCEIVER T-1(DS1) 1 INDUSTRIAL S-PQFP-G80 e3 Not Qualified 3 85 °C -40 °C 260 30 80 PLASTIC/EPOXY LQFP QFP80,.64SQ SQUARE FLATPACK, LOW PROFILE YES Matte Tin (Sn) - annealed GULL WING 650 µm QUAD 14 mm 14 mm 1.6 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 80 compliant EAR99 8542.39.00.01 GREEN, TQFP-80
IDT82P2288BB
Integrated Device Technology Inc
Check for Price No No Transferred 1.8 V BIPOLAR T-1(DS1) PCM TRANSCEIVER 1 INDUSTRIAL S-PBGA-B256 e0 Not Qualified 3 85 °C -40 °C 225 30 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 17 mm 17 mm 3.5 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 256 not_compliant EAR99 8542.39.00.01 PLASTIC, BGA-256
IDT82P2284BBG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 1.8 V BIPOLAR T-1(DS1) PCM TRANSCEIVER T-1(DS1) 1 INDUSTRIAL S-PBGA-B208 e1 Not Qualified 3 85 °C -40 °C 208 PLASTIC/EPOXY BGA BGA208,16X16,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 17 mm 17 mm 1.97 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 208 compliant EAR99 8542.39.00.01 GREEN, PLASTIC, BGA-208
IDT82P2282PF8
Integrated Device Technology Inc
Check for Price No No Transferred 3.3 V BIPOLAR T-1(DS1) PCM TRANSCEIVER T-1(DS1) 1 INDUSTRIAL R-PQFP-G100 e0 Not Qualified 3 85 °C -40 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 14 mm 20 mm 1.6 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 100 not_compliant 8542.39.00.01 TQFP-100
XR-T5620P
Exar Corporation
Check for Price No Obsolete 5.1 V BIPOLAR T-1(DS1) 2.37 Gbps T-148C(DS148C) 30 mA INDUSTRIAL R-PDIP-T18 e0 Not Qualified 85 °C -40 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL EXAR CORP unknown 8542.39.00.01 DIP, DIP18,.3