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Parametric results for: Digital Transmission Support

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DS2175SN+
 Rochester Electronics LLC 		Check for Price Yes Yes Active 5 V CMOS ELASTIC BUFFER 1 INDUSTRIAL R-PDSO-G16 e3 COMMERCIAL 1 85 °C -40 °C 260 NOT SPECIFIED 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm ROCHESTER ELECTRONICS INC SOIC SOP, 16 unknown
DS2175S
 Maxim Integrated Products 		Check for Price No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDSO-G16 e0 Not Qualified 1 70 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm MAXIM INTEGRATED PRODUCTS INC 0.300 INCH, SOIC-16 not_compliant
DS2175N
 Rochester Electronics LLC 		Check for Price No No Active 5 V CMOS ELASTIC BUFFER 1 INDUSTRIAL R-PDIP-T16 e0 COMMERCIAL 1 85 °C -40 °C 240 20 16 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.175 mm 4.572 mm ROCHESTER ELECTRONICS INC DIP DIP, 16 unknown
DS2176+
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA COMMERCIAL R-PDIP-T24 e3 Not Qualified 1 70 °C 260 30 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 7.62 mm 30.545 mm 4.572 mm MAXIM INTEGRATED PRODUCTS INC DIP 0.300 INCH, DIP-24 24 compliant EAR99 8542.39.00.01
DS2176QN
 Maxim Integrated Products 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL S-PQCC-J28 e0 Not Qualified 1 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MAXIM INTEGRATED PRODUCTS INC QLCC PLASTIC, LCC-28 28 compliant EAR99 8542.39.00.01
DS2175SN
 Dallas Semiconductor 		Check for Price No Transferred 5 V CMOS ELASTIC BUFFER 1 16 µA INDUSTRIAL R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm DALLAS SEMICONDUCTOR 0.300 INCH, SOIC-16 unknown
LXP2175SE
 Intel Corporation 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 INDUSTRIAL R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm INTEL CORP SOIC SOP, SOP16,.4 16 compliant 8542.39.00.01
DS2175S+T&R
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDSO-G16 e3 Not Qualified 1 70 °C 260 30 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm MAXIM INTEGRATED PRODUCTS INC SOIC 0.300 INCH, SOIC-16 16 compliant EAR99 8542.32.00.71
LXP2175NC
 Intel Corporation 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 COMMERCIAL R-PDIP-T16 e0 Not Qualified 70 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 5.84 mm INTEL CORP DIP DIP, DIP16,.3 16 compliant 8542.39.00.01
DS2175S
 Dallas Semiconductor 		Check for Price No Transferred 5 V CMOS ELASTIC BUFFER 1 16 mA COMMERCIAL R-PDSO-G16 e0 Not Qualified 70 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm DALLAS SEMICONDUCTOR 0.300 INCH, SOIC-16 unknown
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