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package
HTMS8001FTB/AF,115
 NXP Semiconductors 		$0.0775 Yes Active CMOS TELECOM CIRCUIT Not Qualified 1 260 30 3 PLASTIC/EPOXY QCCN LCC3(UNSPEC) CHIP CARRIER YES NO LEAD QUAD SON QCCN, LCC3(UNSPEC) 3 SOT1122 Compliant 8542.32.00
AP22800HB-7
 Diodes Incorporated 		$0.2538 Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N8 e4 85 °C -40 °C 260 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.6 mm 2.1 mm 605 µm HVSON, Compliant 8542.39.00.01 EAR99
BGSA12UGL8E6327XTSA1
 Infineon Technologies AG 		$0.2879 Yes Active TELECOM CIRCUIT 1 , Compliant 8542.39.00.90 EAR99
package
HT2MOA4S20/E/3/RJ
 NXP Semiconductors 		$0.3020 Yes Not Recommended HYBRID TELECOM CIRCUIT e4 Not Qualified PLASTIC/EPOXY MODULE(UNSPEC) MICROELECTRONIC ASSEMBLY Silver (Ag) COB , MODULE(UNSPEC) 35 SOT500-2 Compliant 8542.32.00 5A992
package
SL3S1013FTB0,115
 NXP Semiconductors 		$0.3290 Yes Active CMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N6 e3 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY VSON RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE YES Tin (Sn) NO LEAD 500 µm DUAL 1 mm 1.45 mm 500 µm SON VSON, 6 SOT886 Compliant 8542.32.00
package
RF37S114HTFJB
 Texas Instruments 		$0.3347 Yes Active TELECOM CIRCUIT SEATED HT-CALCULATED 1 OTHER S-XXMA-X 1 70 °C -25 °C 260 30 UNSPECIFIED XMA SQUARE MICROELECTRONIC ASSEMBLY YES UNSPECIFIED UNSPECIFIED 4 mm 4 mm 760 µm XMA, Compliant 8523.59.00.00 EAR99
BGS12PN10E6327XTSA1
 Infineon Technologies AG 		$0.3394 Yes Yes Active 2.85 V CMOS TELECOM CIRCUIT 1 OTHER R-PBCC-N10 1 85 °C -30 °C 10 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES NO LEAD 400 µm BOTTOM 1.1 mm 1.5 mm 400 µm VQCCN, Compliant 8542.39.00 EAR99
package
SL2S5002FTB,115
 NXP Semiconductors 		$0.3464 Yes Active CMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N3 e3 1 85 °C -40 °C 260 30 3 PLASTIC/EPOXY VSON RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE YES Tin (Sn) NO LEAD 550 µm DUAL 1 mm 1.45 mm 500 µm SON VSON, 3 SOT1122 Compliant 8542.32.00
BGB707L7ESDE6327XTSA1
 Infineon Technologies AG 		$0.3701 Yes Active 3 V TELECOM CIRCUIT 1 R-PDSO-N7 e4 1 AEC-Q101 7 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Palladium/Gold (Pd/Au) NO LEAD 500 µm DUAL 1.3 mm 2 mm 500 µm Compliant 8542.33.00.01 EAR99
BGS16MN14E6327XTSA1
 Infineon Technologies AG 		$0.4255 Yes Obsolete 3.5 V CMOS TELECOM CIRCUIT 1 OTHER S-PQCC-N14 e3 1 85 °C -30 °C 14 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Tin (Sn) NO LEAD 500 µm QUAD 2 mm 2 mm 770 µm HVQCCN, Compliant 8542.39.00.01
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