Parametric results for: Telecom Encryption Circuits
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MC68B59CLDS
Motorola Mobility LLC
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Check for Price | Obsolete | NMOS | DATA ENCRYPTION CIRCUIT | 1 | R-CDIP-T24 | Not Qualified | 24 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | MOTOROLA INC | DIP | DIP, | 24 | unknown | 8542.39.00.01 | ||||||||||||||||||||
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HCS512T/SO
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 5 V | CMOS | DATA ENCRYPTION CIRCUIT | 1 | 10 mA | COMMERCIAL | R-PDSO-G18 | e3 | Not Qualified | 1 | 70 °C | 260 | TS 16949 | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.300 INCH, PLASTIC, SOIC-18 | 18 | compliant | 8542.39.00.01 | Microchip | |||
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HS1-3447-8
Intersil Corporation
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Check for Price | Obsolete | 5 V | CMOS | DATA ENCRYPTION CIRCUIT | 1 | 30 mA | R-XDIP-T16 | e0 | Not Qualified | 38535Q/M;38534H;883B | 16 | CERAMIC | DIP | DIP16,.4 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTERSIL CORP | compliant | 8542.39.00.01 | ||||||||||||||||
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CA95C09-05CT
Integrated Device Technology Inc
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Check for Price | Obsolete | 5 V | CMOS | DATA ENCRYPTION CIRCUIT | 1 | 3 mA | COMMERCIAL | S-PQFP-G44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | NEWBRIDGE MICROSYSTEMS | , | unknown | 8542.39.00.01 | |||||||||||||||||||
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AMZ8068DC
AMD
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Check for Price | No | Obsolete | 5 V | MOS | DATA ENCRYPTION CIRCUIT | 1 | 250 mA | COMMERCIAL | R-GDIP-T40 | e0 | Not Qualified | 70 °C | 40 | CERAMIC, GLASS-SEALED | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP | DIP, DIP40,.6 | 40 | unknown | 8542.39.00.01 | |||||||||||
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MC68A59CSDS
Motorola Semiconductor Products
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Check for Price | No | Obsolete | 5 V | MOS | DATA ENCRYPTION CIRCUIT | 1 | INDUSTRIAL | R-XDIP-T24 | e0 | 85 °C | -40 °C | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA INC | DIP, DIP24,.6 | unknown | 8542.39.00.01 | ||||||||||||||
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HCS300/SN021
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 5 V | DATA ENCRYPTION CIRCUIT | 1 | 2.5 mA | COMMERCIAL | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | DUAL | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 8542.39.00.01 | ||||||||||||
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CA95C18-16IN
Tundra Semiconductor Corp
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Check for Price | No | Obsolete | 5 V | CMOS | DATA ENCRYPTION CIRCUIT | 1 | 48 mA | INDUSTRIAL | S-PQCC-J44 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | TUNDRA SEMICONDUCTOR CORP | unknown | 8542.39.00.01 | |||||||||||||||
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MC68A59CSD
Freescale Semiconductor
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Check for Price | No | Obsolete | 5 V | MOS | DATA ENCRYPTION CIRCUIT | 1 | INDUSTRIAL | R-XDIP-T24 | e0 | 85 °C | -40 °C | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP24,.6 | unknown | 8542.39.00.01 | ||||||||||||||
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CA95C18-5CN
Tundra Semiconductor Corp
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Check for Price | No | Obsolete | 5 V | CMOS | DATA ENCRYPTION CIRCUIT | 1 | 15 mA | COMMERCIAL | S-PQCC-J44 | e0 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.4084 mm | 16.4084 mm | 4.4196 mm | TUNDRA SEMICONDUCTOR CORP | PLASTIC, LCC-44 | unknown |