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21 - 30 of 1,583 results
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BU8872FS-E2
ROHM Semiconductor
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$1.8424 | Yes | Yes | Active | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 4.4 mA | INDUSTRIAL | R-PDSO-G16 | e3/e2 | Not Qualified | 85 °C | -40 °C | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | SOP16,.25,32 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | ROHM CO LTD | SOIC | SSOP-16 | 16 | compliant | 8542.39.00.01 | ROHM Semiconductor | |||
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MT88L70ANR1
Microsemi Corporation
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$1.8574 | Yes | Yes | Transferred | 3 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 5.5 mA | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | MICROSEMI CORP | SSOP | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | 20 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||
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MT8870DN1
Microsemi Corporation
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$1.9968 | Yes | No | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | MICROSEMI CORP | SSOP | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | 20 | unknown | 8542.39.00.01 | Microsemi Corporation | |||||
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M-980-02S
IXYS Integrated Circuits Division
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$2.7232 | No | No | Obsolete | 3 V | CMOS | TONE DECODER CIRCUIT | 1 | 5 µA | INDUSTRIAL | R-PDSO-G16 | e3 | Not Qualified | 85 °C | -40 °C | 250 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | IXYS INTEGRATED CIRCUITS DIVISION | SOIC | SOP, SOP16,.4 | 16 | unknown | 8542.39.00.01 | Tone Decoder Circuit | ||||
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AK2363
Asahi Kasei Microsystems Corporation
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$3.5505 | Obsolete | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N24 | Not Qualified | 85 °C | -40 °C | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | ASAHI KASEI MICRODEVICES CORP | QFN | 4 X 4 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFNJ-24 | 24 | unknown | 8542.39.00.01 | |||||||||||||
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MT8888CSR1
Microsemi Corporation
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$3.9405 | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 11 mA | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | MICROSEMI CORP | SOIC | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | 20 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||
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MT8880CSR1
Microsemi Corporation
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$3.9405 | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 11 mA | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | MICROSEMI CORP | SOIC | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | 20 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||
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MT8880CPR1
Microsemi Corporation
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$4.1740 | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | INDUSTRIAL | S-PQCC-J28 | e3 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 11.505 mm | 11.505 mm | 4.57 mm | MICROSEMI CORP | LCC | LEAD FREE, PLASTIC, MS-018AB, LCC-28 | 28 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||||
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MT8888CPR1
Microsemi Corporation
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$4.1740 | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | INDUSTRIAL | S-PQCC-J28 | e3 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 11.505 mm | 11.505 mm | 4.57 mm | MICROSEMI CORP | QLCC | LEAD FREE, PLASTIC, LCC-28 | 28 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||||
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MT8889CSR1
Microsemi Corporation
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$4.4177 | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 11 mA | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | MICROSEMI CORP | SOIC | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | 20 | compliant | 8542.39.00.01 | Microsemi Corporation |