Parametric results for: 1-HCS085-51TG under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 1

3 hits Apply

1.1 inch 3

3 hits Apply

0.13 inch 3

3 hits Apply

1.1 inch 3

3 hits Apply

11X11 3

3 hits Apply

AU ON NI 1 GOLD OVER NICKEL 1

3 hits Apply

TIN LEAD OVER NICKEL 2 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 1

3 hits Apply

Contact Material (2)

BE-CU 1 BERYLLIUM COPPER ALLOY 1

3 hits Apply

RND PIN-SKT 3

3 hits Apply

IC SOCKET 3

3 hits Apply

PGA85 3

3 hits Apply

GLASS FILLED THERMOPLASTIC 1 POLYPHENYLENE SULFIDE 2

3 hits Apply

e0 3

3 hits Apply

Manufacturer (1)

Advanced Interconnections Corp 3

3 hits Apply

0.1 inch 3

3 hits Apply

STRAIGHT 3

3 hits Apply

Number of Contacts (1)

85 3

3 hits Apply

260.0 °C 1

3 hits Apply

-60.0 °C 1

3 hits Apply

RECTANGULAR 3

3 hits Apply

100 µm 3

3 hits Apply

Obsolete 3

3 hits Apply

No 2

3 hits Apply

Terminal Pitch (1)

2.54 mm 3

3 hits Apply

SOLDER 3

3 hits Apply