Parametric results for: 16-bit page under DRAMs

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Memory IC Type: PAGE MODE DRAM
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KMM58256AP8
Samsung Semiconductor
Check for Price Obsolete 2.0972 Mbit 8 256KX8 5 V 80 ns 512 PAGE MODE DRAM COMMON 256000 262.144 k 3-STATE 150 µA CMOS COMMERCIAL R-PSMA-N30 Not Qualified 70 °C 30 PLASTIC/EPOXY SIMM SIM30 RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD 2.54 mm SINGLE SAMSUNG SEMICONDUCTOR INC SIMM, SIM30 unknown EAR99 8542.32.00.02
MB8265A-15CV
FUJITSU Limited
Check for Price No Obsolete 65.536 kbit 1 64KX1 5 V 150 ns 128 PAGE MODE DRAM SEPARATE 64000 65.536 k 3-STATE MOS COMMERCIAL R-XQCC-N18 Not Qualified e0 70 °C 18 CERAMIC QCCN LCC18,.3X.43 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD FUJITSU LTD QCCN, LCC18,.3X.43 unknown EAR99 8542.32.00.02
F4164-2DCQM
Fairchild Semiconductor Corporation
Check for Price No No Obsolete 65.536 kbit 1 64KX1 5 V 150 ns 256 PAGE MODE DRAM SEPARATE 64000 65.536 k 3-STATE MOS COMMERCIAL R-XDIP-T16 Not Qualified e0 2A 70 °C 16 CERAMIC DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL FAIRCHILD SEMICONDUCTOR CORP DIP, DIP16,.3 compliant EAR99 8542.32.00.02
HB561009A-12
Hitachi Ltd
Check for Price No Obsolete 2.3593 Mbit 9 256KX9 5 V 120 ns 256 PAGE MODE DRAM COMMON 256000 262.144 k 3-STATE MOS COMMERCIAL Not Qualified e0 70 °C 30 PLASTIC/EPOXY SIP30,.2 NO Tin/Lead (Sn/Pb) 2.54 mm SINGLE 17.78 mm HITACHI LTD , SIP30,.2 unknown EAR99 8542.32.00.02
M5M4464P-15
Mitsubishi Electric
Check for Price No Obsolete 262.144 kbit 4 64KX4 5 V 150 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE MOS COMMERCIAL R-PDIP-T18 Not Qualified e0 70 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL MITSUBISHI ELECTRIC CORP DIP, DIP18,.3 unknown EAR99 8542.32.00.02
MT9068MN-15
Micron Technology Inc
Check for Price No Contact Manufacturer 589.824 kbit 9 64KX9 150 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE 135 µA MOS COMMERCIAL Not Qualified e0 70 °C 30 PLASTIC/EPOXY SIP30,.2 NO Tin/Lead (Sn/Pb) 2.54 mm SINGLE MICRON TECHNOLOGY INC , SIP30,.2 compliant
8201001EA
Atmel Corporation
Check for Price No No Obsolete 65.536 kbit 1 64KX1 5 V 150 ns 128 FAST PAGE PAGE MODE DRAM RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH SEPARATE 1 1 64000 65.536 k ASYNCHRONOUS 3-STATE 60 µA 5.5 V 4.5 V NMOS OTHER R-GDIP-T16 Not Qualified e0 110 °C -55 °C 38535Q/M;38534H;883B 16 CERAMIC, GLASS-SEALED DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL ATMEL CORP DIP, DIP16,.3 compliant EAR99 8542.32.00.02 DIP 16
KM4128P20
Samsung Semiconductor
Check for Price No Obsolete 131.072 kbit 1 128KX1 200 ns 128 PAGE MODE DRAM SEPARATE 128000 131.072 k 3-STATE 60 µA MOS COMMERCIAL R-PDIP-T16 Not Qualified e0 70 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SAMSUNG SEMICONDUCTOR INC DIP, DIP16,.3 unknown EAR99 8542.32.00.02
MB81256-12P
FUJITSU Semiconductor Limited
Check for Price Obsolete 262.144 kbit 1 256KX1 5 V 120 ns 256 PAGE PAGE MODE DRAM RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH 1 1 256000 262.144 k ASYNCHRONOUS 3-STATE 5.5 V 4.5 V NMOS COMMERCIAL R-PDIP-T16 Not Qualified 70 °C 16 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 4.65 mm 19.45 mm 7.62 mm FUJITSU SEMICONDUCTOR AMERICA INC DIP, unknown EAR99 8542.32.00.02
HM48416AP-20
Hitachi Ltd
Check for Price No Obsolete 65.536 kbit 4 16KX4 200 ns 128 PAGE MODE DRAM COMMON 16000 16.384 k 3-STATE MOS COMMERCIAL R-PDIP-T18 Not Qualified e0 70 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL HITACHI LTD DIP, DIP18,.3 unknown EAR99 8542.32.00.02