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JAN2N2222AUB
Microchip Technology Inc
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$6.1690 | No | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 8 pF | 500 mW | 500 mW | SWITCHING | SILICON | 300 ns | 35 ns | 1 V | R-XDSO-N3 | e0 | Qualified | MIL-PRF-19500 | 200 °C | -65 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | Microchip | |||||||
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2N2222AUB
Microsemi Corporation
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$6.1862 | No | No | Transferred | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 500 mW | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Not Qualified | MIL-19500/255 | 200 °C | -65 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | HERMETIC SEALED, CERAMIC, CERSOT-3 | not_compliant | SOT | 3 | EAR99 | |||||||
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JANTX2N2222AUB
Microchip Technology Inc
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$6.2919 | No | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | Microchip | ||||||||||||
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2N2222AUB
Microchip Technology Inc
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$6.3682 | No | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 500 mW | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Not Qualified | MIL-19500/255 | 200 °C | -65 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, CERAMIC, CERSOT-3 | compliant | Microchip | ||||||||||
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JANTX2N2222AUB/TR
Microchip Technology Inc
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$6.4432 | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | MIL-19500/255 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | Microchip | EAR99 | 8541.29.00.40 | |||||||||||||||
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2N2222AUB/TR
Microchip Technology Inc
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$6.5532 | No | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | R-CDSO-N3 | MIL-19500/255 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, CERAMIC, CERSOT-3 | compliant | Microchip | ||||||||||||||||||
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JANTXV2N2222AUB
Microchip Technology Inc
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$7.8373 | No | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | Microchip | ||||||||||||
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JANTXV2N2222AUB/TR
Microchip Technology Inc
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$8.0073 | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | unknown | Microchip | EAR99 | 8541.29.00.40 | ||||||||||||
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JAN2N2222AUB
Microsemi Corporation
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$10.2120 | No | No | Transferred | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 8 pF | 500 mW | 500 mW | SWITCHING | SILICON | 300 ns | 35 ns | 1 V | R-XDSO-N3 | e0 | Not Qualified | MIL-PRF-19500 | 200 °C | -65 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | CERAMIC PACKAGE-4 | not_compliant | Microsemi Corporation | 4 | EAR99 | 8541.21.00.95 | |||
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JANTXV2N2222AUB
Microsemi Corporation
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$11.2413 | No | No | Transferred | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Not Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | CERAMIC PACKAGE-4 | not_compliant | Microsemi Corporation | 3 | EAR99 |