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5962-9073101MEA
Temic Semiconductors
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Check for Price | Transferred | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | 1 | 4 | 68 dB | 5 µA | MILITARY | R-GDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 16 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | DUAL | TEMIC SEMICONDUCTORS | , | unknown | ||||||||||||||||||||
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5962-9073101MEA
Harris Semiconductor
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Check for Price | Transferred | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | 1 | 4 | 5 µA | MILITARY | R-GDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 16 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | DUAL | HARRIS SEMICONDUCTOR | , | unknown | 8542.39.00.01 | ||||||||||||||||||||
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5962-9073101MEA
Intersil Corporation
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Check for Price | No | No | Transferred | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | NC | 1 | 4 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-GDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 16 | CERAMIC, GLASS-SEALED | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 19.05 mm | 5.08 mm | 7.62 mm | INTERSIL CORP | DIP, DIP16,.3 | not_compliant | 8542.39.00.01 | DIP | 16 | EAR99 | |||||||
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5962-9073101MEA
Renesas Electronics Corporation
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Check for Price | No | Active | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | 1 | 4 | MILITARY | R-GDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 16 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 19.05 mm | 5.08 mm | 7.62 mm | RENESAS ELECTRONICS CORP | FRIT SEALED, CERDIP-16 | unknown | 8542.39.00.01 | CERDIP | 16 | EAR99 | F16.3 | Renesas Electronics | ||||||||||
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5962-9073101MEA
Vishay Siliconix
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Check for Price | No | Obsolete | NO | 100 Ω | 250 ns | SPST | CMOS | NC | 4 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) - hot dipped | THROUGH-HOLE | 2.54 mm | DUAL | SILICONIX INC | unknown | 8542.39.00.01 | DIP | 16 | |||||||||||||||||
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5962-9073101MEA
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | NC | 1 | 4 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-GDIP-T16 | Not Qualified | e0 | 1 | 125 °C | -55 °C | MIL-STD-883 | 16 | CERAMIC, GLASS-SEALED | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | MAXIM INTEGRATED PRODUCTS INC | DIP, DIP16,.3 | not_compliant | 8542.39.00.01 | DIP | 16 | EAR99 | |||||||||
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5962-9073101MEA
Rochester Electronics LLC
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Check for Price | No | No | Obsolete | 15 V | NO | -15 V | 35 Ω | 175 ns | 145 ns | SPST | CMOS | 1 | 4 | MILITARY | R-GDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 16 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | DUAL | ROCHESTER ELECTRONICS LLC | , | unknown | 8542.39.00.01 |