Findchips: Parametric Search Results for 74AUP1G09GW


Select Parts		Part Number

		74AUP1G09GW,125 Nexperia
		74AUP1G09GW-Q100 Nexperia
		74AUP1G09GW NXP Semiconductors
		74AUP1G09GW,125 NXP Semiconductors
		74AUP1G09GW Nexperia

				Most Relevant											Technical							Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Inputs	Surface Mount	Package Code	Load Capacitance (CL)	Schmitt Trigger	Output Characteristics	Family	Logic IC Type	Technology	Max I(ol)	Power Supply Current-Max (ICC)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	Samacsys Manufacturer	HTS Code	Date Of Intro

$0.1567

Yes

Active

1.1 V

24 ns

YES

TSSOP

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2.05 mm

NEXPERIA

TSSOP

1.25 MM, PLASTIC, MO-203, SOT353-1, SC-88A, TSSOP-5

SOT353-1

compliant

Nexperia

Check for Price

Yes

Active

1.1 V

24 ns

YES

TSSOP

30 pF

YES

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

4 mA

500 nA

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TSSOP5,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

compliant

8542.39.00.01

2019-07-24

Check for Price

Yes

Transferred

1.1 V

24 ns

YES

TSSOP

30 pF

YES

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

1.7 mA

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2.05 mm

NXP SEMICONDUCTORS

TSSOT

TSSOP, TSSOP5/6,.08

compliant

8542.39.00.01

Check for Price

Yes

Transferred

1.1 V

24 ns

YES

TSSOP

30 pF

YES

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

1.7 mA

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2.05 mm

NXP SEMICONDUCTORS

TSSOP

1.25 MM, PLASTIC, MO-203, SOT353-1, SC-88A, TSSOP-5

SOT353-1

compliant

Check for Price

Yes

Active

1.1 V

24 ns

YES

TSSOP

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2.05 mm

NEXPERIA

TSSOP,

compliant

Nexperia

8542.39.00.01

Compare

74AUP1G09GW,125

Nexperia

$0.1567

Yes

Active

1.1 V

24 ns

YES

TSSOP

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2.05 mm

NEXPERIA

TSSOP

1.25 MM, PLASTIC, MO-203, SOT353-1, SC-88A, TSSOP-5

SOT353-1

compliant

Nexperia

74AUP1G09GW-Q100

Nexperia

Check for Price

Yes

Active

1.1 V

24 ns

YES

TSSOP

30 pF

YES

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

4 mA

500 nA

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TSSOP5,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

compliant

8542.39.00.01

2019-07-24

74AUP1G09GW

NXP Semiconductors

Check for Price

Yes

Transferred

1.1 V

24 ns

YES

TSSOP

30 pF

YES

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

1.7 mA

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2.05 mm

NXP SEMICONDUCTORS

TSSOT

TSSOP, TSSOP5/6,.08

compliant

8542.39.00.01

74AUP1G09GW,125

NXP Semiconductors

Check for Price

Yes

Transferred

1.1 V

24 ns

YES

TSSOP

30 pF

YES

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

1.7 mA

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP5/6,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2.05 mm

NXP SEMICONDUCTORS

TSSOP

1.25 MM, PLASTIC, MO-203, SOT353-1, SC-88A, TSSOP-5

SOT353-1

compliant

74AUP1G09GW

Nexperia

Check for Price

Yes

Active

1.1 V

24 ns

YES

TSSOP

OPEN-DRAIN

AUP/ULP/V

AND GATE

CMOS

3.6 V

800 mV

AUTOMOTIVE

R-PDSO-G5

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2.05 mm

NEXPERIA

TSSOP,

compliant

Nexperia

8542.39.00.01

Parametric results for: 74AUP1G09GW under Gates