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74AVC8T245BQ,118
Nexperia
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$0.5868 | Yes | Active | 1.2 V | 9.9 ns | 1 | 8 | YES | HVQCCN | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR, 13 INCH | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NEXPERIA | QFN | DHVQFN-24 | 24 | SOT815-1 | compliant | 2017-02-01 | Nexperia | ||||||||||||
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74AVC8T245BQ,118
NXP Semiconductors
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$0.6705 | Yes | Transferred | 1.1 V | 9.9 ns | 9 ns | 1 | 8 | YES | HVQCCN | 15 pF | BIDIRECTIONAL | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | COMMON CONTROL | 6 mA | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | LCC24/28,.14X.2,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NXP SEMICONDUCTORS | QFN | 3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24 | 24 | SOT815-1 | compliant | |||||||||
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74AVC8T245BQ-Q100J
Nexperia
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$1.1301 | Yes | Active | 1.2 V | 9.9 ns | 1 | 8 | YES | HVQCCN | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 24 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR, 13 INCH | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NEXPERIA | QFN | 3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24 | 24 | SOT815-1 | compliant | Nexperia | ||||||||||||
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74AVC8T245BQ-Q100
Nexperia
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Check for Price | Yes | Active | 1.2 V | 9.9 ns | 1 | 8 | YES | HVQCCN | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 24 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NEXPERIA | DHVQFN-24 | compliant | 8542.39.00.01 | ||||||||||||||||
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74AVC8T245BQ
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 1.1 V | 9.9 ns | 1 | 8 | YES | HVQCCN | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NXP SEMICONDUCTORS | QFN | 3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24 | 24 | compliant | NXP | 8542.39.00.01 | ||||||||||||
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74AVC8T245BQ,115
NXP Semiconductors
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Check for Price | Active | 1.1 V | 9.9 ns | 1 | 8 | YES | HVQCCN | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | 125 °C | -40 °C | 24 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NXP SEMICONDUCTORS | QFN | 3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24 | 24 | SOT815-1 | unknown | |||||||||||||||||||||
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74AVC8T245BQ-Q100J
NXP Semiconductors
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Check for Price | Yes | Transferred | 1.2 V | 9.9 ns | 9.9 ns | 1 | 8 | YES | HVQCCN | 15 pF | BIDIRECTIONAL | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | COMMON CONTROL | 6 mA | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | Not Qualified | 125 °C | -40 °C | AEC-Q100 | 24 | PLASTIC/EPOXY | LCC24/28,.14X.2,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NXP SEMICONDUCTORS | QFN | 3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24 | 24 | SOT815-1 | compliant | |||||||||||
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74AVC8T245BQ-Q100
NXP Semiconductors
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Check for Price | Yes | Transferred | 1.2 V | 9.9 ns | 1 | 8 | YES | HVQCCN | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | 1 | 125 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 24 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NXP SEMICONDUCTORS | QFN | 3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24 | 24 | unknown | 8542.39.00.01 | ||||||||||||||||
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74AVC8T245BQ,115
Nexperia
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Check for Price | Active | 1.2 V | 9.9 ns | 1 | 8 | YES | HVQCCN | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NEXPERIA | QFN | HVQCCN, | 24 | SOT815-1 | compliant | 2017-02-01 | Nexperia | ||||||||||||||
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74AVC8T245BQ
Nexperia
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Check for Price | Yes | Active | 1.2 V | 9.9 ns | 1 | 8 | YES | HVQCCN | 3-STATE | AVC | BUS TRANSCEIVER | CMOS | 2 | TRUE | 3.6 V | 800 mV | AUTOMOTIVE | R-PQCC-N24 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 3.5 mm | 5.5 mm | NEXPERIA | compliant | 2017-02-01 | Nexperia | 8542.39.00.01 |