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Manufacturer Part Number: 74hc2g34gw
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74HC2G34GW,125
 Nexperia 		$0.1090 Yes Active 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR, 7 INCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP SC-88, 6 PIN 6 SOT363-2 compliant 8542.39.00.01 2017-02-01 Nexperia
74HC2G34GW-Q100
 Nexperia 		Check for Price Yes Active 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 AEC-Q100 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA SC-88, 6 PIN compliant 8542.39.00.01 2017-02-01
74HC2G34GW-Q100
 NXP Semiconductors 		Check for Price Transferred 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 125 °C -40 °C AEC-Q100 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS SOT-363 TSSOP, 6 unknown 8542.39.00.01
74HC2G34GW
 Nexperia 		Check for Price Yes Active 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP, compliant 8542.39.00.01 2017-02-01
74HC2G34GW-Q100H
 NXP Semiconductors 		Check for Price Yes Transferred 5 V 125 ns 25 ns 2 1 YES TSSOP 50 pF NO HC/UH BUFFER CMOS 4 mA 6 V 2 V AUTOMOTIVE R-PDSO-G6 Not Qualified 125 °C -40 °C AEC-Q100 6 PLASTIC/EPOXY TSSOP6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS TSSOP PLASTIC, SOT-363, SC-88, 6 PIN 6 SOT363 compliant
74HC2G34GW-Q100H
 Nexperia 		Check for Price Active 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 AEC-Q100 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR, 7 INCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP TSSOP, 6 SOT363-2 compliant 2017-02-01 Nexperia
74HC2G34GW-G
 NXP Semiconductors 		Check for Price Yes Transferred 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS SOT-363 PLASTIC, SOT363, SC-88, 6 PIN 6 unknown 8542.39.00.01
74HC2G34GW-Q100,125
 NXP Semiconductors 		Check for Price Active 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 125 °C -40 °C AEC-Q100 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS TSSOP, unknown 8542.39.00.01
74HC2G34GW,125
 NXP Semiconductors 		Check for Price Yes Transferred 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS TSSOP PLASTIC, SOT363, SC-88, 6 PIN 6 SOT363 compliant 8542.39.00.01
74HC2G34GW-G
 Nexperia 		Check for Price Yes Active 5 V 125 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP, compliant 8542.39.00.01 2017-02-01
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