Findchips: Parametric Search Results for 74HC4050DB


Select Parts		Part Number

		74HC4050D(BJ) Toshiba America Electronic Components
		74HC4050DB,112 Nexperia
		74HC4050DB,112 NXP Semiconductors
		74HC4050DB-T NXP Semiconductors
		74HC4050DB,118 Nexperia
		74HC4050DB NXP Semiconductors
		74HC4050DB Nexperia
		74HC4050DB,118 NXP Semiconductors
		74HC4050DB-T Nexperia

				Most Relevant										Technical							Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Inputs	Surface Mount	Package Code	Load Capacitance (CL)	Schmitt Trigger	Family	Logic IC Type	Technology	Additional Feature	Max I(ol)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	Samacsys Manufacturer	Part Package Code	Pin Count	Manufacturer Package Code	HTS Code	Date Of Intro

$0.3747

Yes

End Of Life

4.5 V

175 ns

35 ns

YES

SOP

150 pF

HC/UH

BUFFER

CMOS

7.8 mA

6 V

2 V

R-PDSO-G16

125 °C

-40 °C

PLASTIC/EPOXY

SOP16,.24

RECTANGULAR

SMALL OUTLINE

GULL WING

1.27 mm

DUAL

1.75 mm

3.9 mm

10.2 mm

TOSHIBA CORP

SOIC-16

unknown

Toshiba

$0.4073

Yes

Obsolete

5 V

130 ns

YES

SSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NEXPERIA

SSOP-16

compliant

Nexperia

SSOP1

SOT338-1

8542.39.00.01

2017-02-01

Check for Price

Yes

Transferred

5 V

26 ns

YES

SSOP

50 pF

HC/UH

BUFFER

CMOS

CMOS-TTL LEVEL TRANSLATOR

4 mA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

SSOP16,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

TUBE

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NXP SEMICONDUCTORS

SSOP-16

compliant

SSOP1

SOT338-1

8542.39.00.01

Check for Price

Yes

Transferred

5 V

26 ns

YES

SSOP

50 pF

HC/UH

BUFFER

CMOS

CMOS-TTL LEVEL TRANSLATOR

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

Not Qualified

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NXP SEMICONDUCTORS

SSOP,

unknown

SOIC

8542.39.00.01

Check for Price

Active

5 V

130 ns

YES

SSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NEXPERIA

SSOP,

compliant

Nexperia

SSOP1

SOT338-1

8542.39.00.01

2017-02-01

Check for Price

Yes

Transferred

5 V

26 ns

YES

SSOP

50 pF

HC/UH

BUFFER

CMOS

CMOS-TTL LEVEL TRANSLATOR

4 mA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

SSOP16,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NXP SEMICONDUCTORS

SSOP-16

unknown

SOIC

8542.39.00.01

Check for Price

Yes

Not Recommended

5 V

130 ns

YES

SSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NEXPERIA

SSOP-16

compliant

8542.39.00.01

2017-02-01

Check for Price

Yes

Transferred

5 V

26 ns

YES

SSOP

50 pF

HC/UH

BUFFER

CMOS

CMOS-TTL LEVEL TRANSLATOR

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

Not Qualified

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NXP SEMICONDUCTORS

SSOP,

unknown

SSOP1

SOT338-1

8542.39.00.01

Check for Price

Yes

Obsolete

5 V

130 ns

YES

SSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NEXPERIA

SSOP,

compliant

8542.39.00.01

2017-02-01

Compare

74HC4050D(BJ)

Toshiba America Electronic Components

$0.3747

Yes

End Of Life

4.5 V

175 ns

35 ns

YES

SOP

150 pF

HC/UH

BUFFER

CMOS

7.8 mA

6 V

2 V

R-PDSO-G16

125 °C

-40 °C

PLASTIC/EPOXY

SOP16,.24

RECTANGULAR

SMALL OUTLINE

GULL WING

1.27 mm

DUAL

1.75 mm

3.9 mm

10.2 mm

TOSHIBA CORP

SOIC-16

unknown

Toshiba

74HC4050DB,112

Nexperia

$0.4073

Yes

Obsolete

5 V

130 ns

YES

SSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NEXPERIA

SSOP-16

compliant

Nexperia

SSOP1

SOT338-1

8542.39.00.01

2017-02-01

74HC4050DB,112

NXP Semiconductors

Check for Price

Yes

Transferred

5 V

26 ns

YES

SSOP

50 pF

HC/UH

BUFFER

CMOS

CMOS-TTL LEVEL TRANSLATOR

4 mA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

SSOP16,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

TUBE

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NXP SEMICONDUCTORS

SSOP-16

compliant

SSOP1

SOT338-1

8542.39.00.01

74HC4050DB-T

NXP Semiconductors

Check for Price

Yes

Transferred

5 V

26 ns

YES

SSOP

50 pF

HC/UH

BUFFER

CMOS

CMOS-TTL LEVEL TRANSLATOR

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

Not Qualified

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NXP SEMICONDUCTORS

SSOP,

unknown

SOIC

8542.39.00.01

74HC4050DB,118

Nexperia

Check for Price

Active

5 V

130 ns

YES

SSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NEXPERIA

SSOP,

compliant

Nexperia

SSOP1

SOT338-1

8542.39.00.01

2017-02-01

74HC4050DB

NXP Semiconductors

Check for Price

Yes

Transferred

5 V

26 ns

YES

SSOP

50 pF

HC/UH

BUFFER

CMOS

CMOS-TTL LEVEL TRANSLATOR

4 mA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

SSOP16,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NXP SEMICONDUCTORS

SSOP-16

unknown

SOIC

8542.39.00.01

74HC4050DB

Nexperia

Check for Price

Yes

Not Recommended

5 V

130 ns

YES

SSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NEXPERIA

SSOP-16

compliant

8542.39.00.01

2017-02-01

74HC4050DB,118

NXP Semiconductors

Check for Price

Yes

Transferred

5 V

26 ns

YES

SSOP

50 pF

HC/UH

BUFFER

CMOS

CMOS-TTL LEVEL TRANSLATOR

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

Not Qualified

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NXP SEMICONDUCTORS

SSOP,

unknown

SSOP1

SOT338-1

8542.39.00.01

74HC4050DB-T

Nexperia

Check for Price

Yes

Obsolete

5 V

130 ns

YES

SSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

GULL WING

650 µm

DUAL

2 mm

5.3 mm

6.2 mm

NEXPERIA

SSOP,

compliant

8542.39.00.01

2017-02-01

Parametric results for: 74HC4050DB under Gates