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74HC4052D,653
Nexperia
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$0.1870 | Yes | Active | 5 V | YES | 195 Ω | 6 Ω | 69 ns | 57 ns | SP4T | CMOS | 4 | 2 | 50 dB | 10 V | 2 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 9.9 mm | 1.75 mm | 3.9 mm | NEXPERIA | SOP | SOP-16 | 16 | SOT109-1 | compliant | 8542.39.00.01 | 1993-11-01 | Nexperia | ||||||||||||
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74HC4052D
Toshiba America Electronic Components
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$0.2218 | Yes | Active | SINGLE-ENDED MULTIPLEXER | 260 | 30 | TOSHIBA CORP | compliant | 8542.39.00.01 | 2016-05-24 | Toshiba | ||||||||||||||||||||||||||||||||||||||||||||||||
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74HC4052D,652
Nexperia
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$0.2247 | Yes | Obsolete | 5 V | YES | 195 Ω | 6 Ω | 69 ns | 57 ns | SP4T | CMOS | 4 | 2 | 50 dB | 10 V | 2 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 9.9 mm | 1.75 mm | 3.9 mm | NEXPERIA | SOP | SOP-16 | 16 | SOT109-1 | compliant | 8542.39.00.01 | 1993-11-01 | Nexperia | ||||||||||||
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74HC4052D,652
NXP Semiconductors
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$0.2340 | Yes | Transferred | 5 V | YES | -4.5 V | 195 Ω | 6 Ω | 69 ns | 57 ns | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | -5 V | -1 V | 4 | 1 | 50 dB | 10 V | 2 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 9.9 mm | 1.75 mm | 3.9 mm | NXP SEMICONDUCTORS | SOP | 3.90 MM, 1.47 MM THICKNESS, MS-012AC, SOT-109-3, PLASTIC, SO-16 | 16 | SOT109-1 | compliant | 8542.39.00.01 | |||||||||
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74HC4052D-Q100,118
Nexperia
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$0.2543 | Yes | Active | 5 V | YES | 270 Ω | 490 ns | 375 ns | SP4T | CMOS | 10 V | NO | 4 | 2 | 50 dB | COMMON OUTPUT | 20 mA | 10 V | 2 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | NICKEL PALLADIUM GOLD SILVER | GULL WING | 1.27 mm | DUAL | 9.9 mm | 1.75 mm | 3.9 mm | NEXPERIA | SOP | SOP-16 | 16 | SOT109-1 | compliant | 8542.39.00.01 | Nexperia | |||||||||
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74HC4052D-Q100,118
NXP Semiconductors
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$0.2748 | Yes | Transferred | 5 V | YES | 270 Ω | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | 4 | 1 | 320 µA | 10 V | 2 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | GULL WING | 1.27 mm | DUAL | NXP SEMICONDUCTORS | SOP | 16 | SOT109-1 | compliant | |||||||||||||||||||||
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74HC4052DB,112
Nexperia
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$0.5072 | Yes | Obsolete | 5 V | YES | 195 Ω | 6 Ω | 69 ns | 57 ns | SP4T | CMOS | 4 | 2 | 50 dB | 10 V | 2 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 6.2 mm | 2 mm | 5.3 mm | NEXPERIA | SSOP1 | SSOP-16 | 16 | SOT338-1 | compliant | 8542.39.00.01 | 1995-11-01 | Nexperia | ||||||||||||
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74HC4052DB,112
NXP Semiconductors
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$0.5200 | Yes | Transferred | 5 V | YES | -4.5 V | 195 Ω | 6 Ω | 69 ns | 57 ns | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | -5 V | -1 V | 4 | 1 | 50 dB | 320 µA | 10 V | 2 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 6.2 mm | 2 mm | 5.3 mm | NXP SEMICONDUCTORS | SSOP1 | 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 | 16 | SOT338-1 | compliant | 8542.39.00.01 | NXP | |||||||
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74HC4052DB,118
Nexperia
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$0.9443 | Yes | Obsolete | 5 V | YES | 195 Ω | 6 Ω | 69 ns | 57 ns | SP4T | CMOS | 4 | 2 | 50 dB | 10 V | 2 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 6.2 mm | 2 mm | 5.3 mm | NEXPERIA | SSOP1 | SSOP-16 | 16 | SOT338-1 | compliant | 8542.39.00.01 | 1995-11-01 | Nexperia | ||||||||||||
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MC74HC4052DT
onsemi
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$51.1516 | Yes | Obsolete | 4.5 V | YES | -4.5 V | 170 Ω | 18 Ω | 15 ns | 15 ns | 25 mA | SINGLE-ENDED MULTIPLEXER | CMOS | -6 V | -1 V | 4 | 1 | 50 dB | 160 µA | 6 V | 1 V | BREAK-BEFORE-MAKE | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 125 °C | -55 °C | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 5 mm | 1.2 mm | 4.4 mm | ONSEMI | TSSOP | 16 | unknown | 8542.39.00.01 |