Findchips: Parametric Search Results for 74HC74BQ-Q100%2C115


Select Parts		Part Number

		74HC74BQ-Q100 NXP Semiconductors
		74HC74BQ-Q100 Nexperia
		74HC74BQ-Q100,115 Nexperia
		74HC74BQ-Q100,115 NXP Semiconductors

			Most Relevant										Technical								Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Number of Functions	Number of Bits	Surface Mount	Package Code	Max Frequency@Nom-Sup	Load Capacitance (CL)	Trigger Type	Family	Logic IC Type	Technology	fmax-Min	Max I(ol)	Output Polarity	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	Date Of Intro	Manufacturer Package Code	Samacsys Manufacturer

Check for Price

Yes

Transferred

5 V

265 ns

YES

HVQCCN

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

24 MHz

COMPLEMENTARY

6 V

2 V

AUTOMOTIVE

R-PQCC-N14

125 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NO LEAD

500 µm

QUAD

1 mm

2.5 mm

3 mm

NXP SEMICONDUCTORS

QFN

2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

unknown

8542.39.00.01

Check for Price

Yes

Active

5 V

265 ns

YES

HVQCCN

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

18 MHz

COMPLEMENTARY

6 V

2 V

AUTOMOTIVE

R-PQCC-N14

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD SILVER

NO LEAD

500 µm

QUAD

1 mm

2.5 mm

3 mm

NEXPERIA

HVQCCN,

compliant

8542.39.00.01

2017-02-01

Check for Price

Yes

Active

5 V

265 ns

YES

HVQCCN

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

24 MHz

COMPLEMENTARY

6 V

2 V

AUTOMOTIVE

R-PQCC-N14

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TR, 7 INCH

NICKEL PALLADIUM GOLD SILVER

NO LEAD

500 µm

QUAD

1 mm

2.5 mm

3 mm

NEXPERIA

QFN

DHVQFN-14

compliant

SOT762-1

Nexperia

Check for Price

Yes

Transferred

5 V

265 ns

YES

HVQCCN

20 MHz

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

24 MHz

4 mA

COMPLEMENTARY

6 V

2 V

AUTOMOTIVE

R-PQCC-N14

Not Qualified

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

LCC14,.1X.12,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NO LEAD

500 µm

QUAD

1 mm

2.5 mm

3 mm

NXP SEMICONDUCTORS

QFN

2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

compliant

SOT762-1

Compare

74HC74BQ-Q100

NXP Semiconductors

Check for Price

Yes

Transferred

5 V

265 ns

YES

HVQCCN

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

24 MHz

COMPLEMENTARY

6 V

2 V

AUTOMOTIVE

R-PQCC-N14

125 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NO LEAD

500 µm

QUAD

1 mm

2.5 mm

3 mm

NXP SEMICONDUCTORS

QFN

2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

unknown

8542.39.00.01

74HC74BQ-Q100

Nexperia

Check for Price

Yes

Active

5 V

265 ns

YES

HVQCCN

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

18 MHz

COMPLEMENTARY

6 V

2 V

AUTOMOTIVE

R-PQCC-N14

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD SILVER

NO LEAD

500 µm

QUAD

1 mm

2.5 mm

3 mm

NEXPERIA

HVQCCN,

compliant

8542.39.00.01

2017-02-01

74HC74BQ-Q100,115

Nexperia

Check for Price

Yes

Active

5 V

265 ns

YES

HVQCCN

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

24 MHz

COMPLEMENTARY

6 V

2 V

AUTOMOTIVE

R-PQCC-N14

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TR, 7 INCH

NICKEL PALLADIUM GOLD SILVER

NO LEAD

500 µm

QUAD

1 mm

2.5 mm

3 mm

NEXPERIA

QFN

DHVQFN-14

compliant

SOT762-1

Nexperia

74HC74BQ-Q100,115

NXP Semiconductors

Check for Price

Yes

Transferred

5 V

265 ns

YES

HVQCCN

20 MHz

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

24 MHz

4 mA

COMPLEMENTARY

6 V

2 V

AUTOMOTIVE

R-PQCC-N14

Not Qualified

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

LCC14,.1X.12,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NO LEAD

500 µm

QUAD

1 mm

2.5 mm

3 mm

NXP SEMICONDUCTORS

QFN

2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

compliant

SOT762-1

Parametric results for: 74HC74BQ-Q100%2C115 under FF/Latches