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74HCT4052BQ,115
Nexperia
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$0.3273 | Active | 5 V | YES | 195 Ω | 6 Ω | 72 ns | 57 ns | SP4T | CMOS | NO | 4 | 2 | 50 dB | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NEXPERIA | QFN | HVQCCN, | 16 | SOT763-1 | compliant | 8542.39.00.01 | Nexperia | ||||||||||||||
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74HCT4052BQ-Q100
Nexperia
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Check for Price | Yes | Active | 5 V | YES | 270 Ω | 88 ns | 63 ns | SP4T | CMOS | NO | 4 | 2 | 50 dB | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NEXPERIA | DHVQFN-16 | compliant | 8542.39.00.01 | ||||||||||||||||||
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74HCT4052BQ-Q100,1
Nexperia
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Check for Price | Yes | Active | 5 V | YES | 270 Ω | 105 ns | 75 ns | SP4T | CMOS | 5.5 V | NO | 4 | 2 | 50 dB | COMMON OUTPUT | 20 mA | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NEXPERIA | QFN | DHVQFN-16 | 16 | SOT763-1 | compliant | 8542.39.00.01 | Nexperia | |||||||||||
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74HCT4052BQ
Philips Semiconductors
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Check for Price | No | Transferred | 5 V | YES | 270 Ω | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | NO | 4 | 1 | 320 µA | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e0 | 125 °C | -40 °C | 16 | PLASTIC/EPOXY | QCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | PHILIPS SEMICONDUCTORS | QCCN, LCC16,.1X.14,20 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||
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74HCT4052BQ-Q100
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | YES | 270 Ω | 88 ns | 63 ns | SINGLE-ENDED MULTIPLEXER | CMOS | NO | 4 | 1 | 50 dB | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | 1 | 125 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NXP SEMICONDUCTORS | DHVQFN-16 | unknown | 8542.39.00.01 | ||||||||||||||||||||
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74HCT4052BQ,115
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | YES | -4.5 V | 195 Ω | 6 Ω | 72 ns | 57 ns | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | -5 V | -1 V | NO | 4 | 1 | 50 dB | 320 µA | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16 | 16 | SOT763-1 | compliant | 8542.39.00.01 | |||||||||
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74HCT4052BQ
Nexperia
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Check for Price | Yes | Active | 5 V | YES | 195 Ω | 6 Ω | 72 ns | 57 ns | SP4T | CMOS | NO | 4 | 2 | 50 dB | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NEXPERIA | HVQCCN, | compliant | 8542.39.00.01 | EAR99 | 1991-01-01 | ||||||||||||||||
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74HCT4052BQ-G
NXP Semiconductors
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Check for Price | No | Yes | Obsolete | 5 V | YES | 270 Ω | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | NO | 4 | 1 | 320 µA | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | 125 °C | -40 °C | 16 | PLASTIC/EPOXY | QCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | unknown | ||||||||||||||||||||||||||||
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74HCT4052BQ
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 5 V | YES | -4.5 V | 195 Ω | 6 Ω | 72 ns | 57 ns | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | -5 V | -1 V | NO | 4 | 1 | 50 dB | 320 µA | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3.5 mm | 1 mm | 2.5 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16 | 16 | compliant | 8542.39.00.01 | |||||||||
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74HCT4052BQ-Q100,1
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | YES | 270 Ω | 25 mA | DIFFERENTIAL MULTIPLEXER | CMOS | NO | 4 | 1 | 320 µA | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | 125 °C | -40 °C | AEC-Q100 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | QFN | 16 | SOT763-1 | compliant |