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74HCT74BQ,115
Nexperia
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$0.1339 | Yes | Active | 5 V | 53 ns | 2 | 1 | YES | HVQCCN | POSITIVE EDGE | HCT | D FLIP-FLOP | CMOS | 18 MHz | COMPLEMENTARY | 5.5 V | 4.5 V | AUTOMOTIVE | R-PQCC-N14 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR, 7 INCH | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3 mm | NEXPERIA | QFN | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 | 14 | SOT762-1 | compliant | 8542.39.00.01 | 1993-01-01 | Nexperia | |||||||||
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74HCT74BQ-Q100
Nexperia
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Check for Price | Yes | Active | 5 V | 53 ns | 2 | 1 | YES | HVQCCN | POSITIVE EDGE | HCT | D FLIP-FLOP | CMOS | 18 MHz | COMPLEMENTARY | 5.5 V | 4.5 V | AUTOMOTIVE | R-PQCC-N14 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 14 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3 mm | NEXPERIA | DHVQFN-14 | compliant | 8542.39.00.01 | 2017-02-01 | ||||||||||||||
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74HCT74BQ
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 5 V | 53 ns | 2 | 1 | YES | HVQCCN | 18 MHz | 50 pF | POSITIVE EDGE | HCT | D FLIP-FLOP | CMOS | 18 MHz | 4 mA | COMPLEMENTARY | 5.5 V | 4.5 V | AUTOMOTIVE | R-PQCC-N14 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | LCC14,.1X.12,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3 mm | NXP SEMICONDUCTORS | QFN | HVQCCN, LCC14,.1X.12,20 | 14 | compliant | 8542.39.00.01 | |||||||
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74HCT74BQ
Nexperia
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Check for Price | Yes | Active | 5 V | 53 ns | 2 | 1 | YES | HVQCCN | POSITIVE EDGE | HCT | D FLIP-FLOP | CMOS | 18 MHz | COMPLEMENTARY | 5.5 V | 4.5 V | AUTOMOTIVE | R-PQCC-N14 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3 mm | NEXPERIA | HVQCCN, | compliant | 8542.39.00.01 | 1991-01-01 | EAR99 | ||||||||||||||
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74HCT74BQ-Q100,115
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 53 ns | 2 | 1 | YES | HVQCCN | 18 MHz | 50 pF | POSITIVE EDGE | HCT | D FLIP-FLOP | CMOS | 18 MHz | 4 mA | COMPLEMENTARY | 5.5 V | 4.5 V | AUTOMOTIVE | R-PQCC-N14 | Not Qualified | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 14 | PLASTIC/EPOXY | LCC14,.1X.12,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | 14 | SOT762-1 | compliant | |||||||||
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74HCT74BQ,115
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 53 ns | 2 | 1 | YES | HVQCCN | 18 MHz | 50 pF | POSITIVE EDGE | HCT | D FLIP-FLOP | CMOS | 18 MHz | 4 mA | COMPLEMENTARY | 5.5 V | 4.5 V | AUTOMOTIVE | R-PQCC-N14 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | LCC14,.1X.12,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 | 14 | SOT762-1 | compliant | 8542.39.00.01 | |||||||
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74HCT74BQ-Q100,115
Nexperia
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Check for Price | Active | 5 V | 53 ns | 2 | 1 | YES | HVQCCN | POSITIVE EDGE | HCT | D FLIP-FLOP | CMOS | 18 MHz | COMPLEMENTARY | 5.5 V | 4.5 V | AUTOMOTIVE | R-PQCC-N14 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 14 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR, 7 INCH | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3 mm | NEXPERIA | QFN | DHVQFN-14 | 14 | SOT762-1 | compliant | Nexperia | ||||||||||||
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74HCT74BQ-Q100
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 53 ns | 2 | 1 | YES | HVQCCN | POSITIVE EDGE | HCT | D FLIP-FLOP | CMOS | 18 MHz | COMPLEMENTARY | 5.5 V | 4.5 V | AUTOMOTIVE | R-PQCC-N14 | 1 | 125 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 14 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | 14 | unknown | 8542.39.00.01 | |||||||||||||||
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74HCT74BQ
Philips Semiconductors
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Check for Price | Yes | Transferred | 5 V | 2 | YES | QCCN | 18 MHz | 50 pF | POSITIVE EDGE | D FLIP-FLOP | CMOS | 4 mA | AUTOMOTIVE | R-PQCC-N14 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 14 | PLASTIC/EPOXY | LCC14,.1X.12,20 | RECTANGULAR | CHIP CARRIER | TR | NO LEAD | 500 µm | QUAD | PHILIPS SEMICONDUCTORS | QCCN, LCC14,.1X.12,20 | unknown | 8542.39.00.01 |