Parametric results for: 74SSTUBF32866BBFG under FF/Latches

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Manufacturer Part Number: 74sstubf32866bbfg
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74SSTUBF32866BBFG
Integrated Device Technology Inc
$1.0000 Yes Yes Transferred 1.8 V 1.5 ns 1 25 YES FBGA POSITIVE EDGE SSTU D FLIP-FLOP TTL 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e1 3 70 °C 260 96 PLASTIC/EPOXY BGA96,6X16,32 RECTANGULAR GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.81 mm 5.5 mm 13.5 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA GREEN, MO-205CC, LFBGA-96 96 BFG96 compliant EAR99 8542.39.00.01
74SSTUBF32866BBFG
Renesas Electronics Corporation
$3.8244 Yes Obsolete 1.8 V 1.5 ns 1 25 YES FBGA POSITIVE EDGE SSTU D FLIP-FLOP 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e1 3 70 °C 260 96 PLASTIC/EPOXY BGA96,6X16,32 RECTANGULAR GRID ARRAY, FINE PITCH TRAY TIN SILVER COPPER BALL 800 µm BOTTOM 1.81 mm 5.5 mm 13.5 mm RENESAS ELECTRONICS CORP CABGA FBGA, BGA96,6X16,32 96 BFG96 compliant 8542.39.00.01 Renesas Electronics
74SSTUBF32866BBFG8
Renesas Electronics Corporation
Check for Price Yes Obsolete BUS DRIVER Not Qualified e1 3 260 TIN SILVER COPPER RENESAS ELECTRONICS CORP CABGA FBGA, BGA96,6X16,32 96 BFG96 compliant 8542.39.00.01 Renesas Electronics
IDT74SSTUBF32866BBFG8
Renesas Electronics Corporation
Check for Price Yes Obsolete 1.8 V 1.5 ns 1 25 YES FBGA POSITIVE EDGE SSTU D FLIP-FLOP 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e1 3 70 °C 96 PLASTIC/EPOXY BGA96,6X16,32 RECTANGULAR GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.81 mm 5.5 mm 13.5 mm RENESAS ELECTRONICS CORP FBGA, BGA96,6X16,32 compliant EAR99 8542.39.00.01
74SSTUBF32866BBFG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 1.8 V 1.5 ns 1 25 YES FBGA POSITIVE EDGE OPEN-DRAIN 32866 D FLIP-FLOP CMOS 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e1 3 70 °C 260 96 PLASTIC/EPOXY BGA96,6X16,32 RECTANGULAR GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.81 mm 5.5 mm 13.5 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA LFBGA-96 96 BFG96 compliant EAR99 8542.39.00.01
IDT74SSTUBF32866BBFG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 1.8 V 1.5 ns 1 25 YES FBGA POSITIVE EDGE SSTU D FLIP-FLOP TTL 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e1 3 70 °C 96 PLASTIC/EPOXY BGA96,6X16,32 RECTANGULAR GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.81 mm 5.5 mm 13.5 mm INTEGRATED DEVICE TECHNOLOGY INC BGA GREEN, MO-205CC, LFBGA-96 96 compliant EAR99 8542.39.00.01
IDT74SSTUBF32866BBFG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 1.8 V 1.5 ns 1 25 YES FBGA POSITIVE EDGE SSTU D FLIP-FLOP TTL 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e1 3 70 °C 96 PLASTIC/EPOXY BGA96,6X16,32 RECTANGULAR GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.81 mm 5.5 mm 13.5 mm INTEGRATED DEVICE TECHNOLOGY INC BGA GREEN, MO-205CC, LFBGA-96 96 compliant EAR99 8542.39.00.01
IDT74SSTUBF32866BBFG
Renesas Electronics Corporation
Check for Price Yes Obsolete 1.8 V 1.5 ns 1 25 YES FBGA POSITIVE EDGE SSTU D FLIP-FLOP 410 MHz TRUE 1.9 V 1.7 V COMMERCIAL R-PBGA-B96 Not Qualified e1 3 70 °C 96 PLASTIC/EPOXY BGA96,6X16,32 RECTANGULAR GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.81 mm 5.5 mm 13.5 mm RENESAS ELECTRONICS CORP FBGA, BGA96,6X16,32 compliant EAR99 8542.39.00.01