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74AHC157BQ,115
NXP Semiconductors
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Check for Price | Yes | Transferred | 5 V | 21.5 ns | 4 | 2 | 1 | YES | HVQCCN | AHC/VHC/H/U/V | MULTIPLEXER | CMOS | TRUE | 5.5 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3.5 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 3.50 MM, 0.85 MM HEIGHT, MO-241, SOT763-1, DHVQFN-16 | 16 | SOT763-1 | unknown | 8542.39.00.01 | ||||||||||||
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74AHC157BQ
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 5 V | 21.5 ns | 11 ns | 4 | 2 | 1 | YES | HVQCCN | 50 pF | AHC/VHC/H/U/V | MULTIPLEXER | CMOS | 8 mA | TRUE | 5.5 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3.5 mm | NXP SEMICONDUCTORS | QFN | HVQCCN, LCC16,.1X.14,20 | 16 | compliant | 8542.39.00.01 | ||||||||
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74AHC157BQ-Q100
Nexperia
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Check for Price | Yes | Active | 5 V | 16.5 ns | 10.5 ns | 4 | 2 | 1 | YES | HVQCCN | 50 pF | AHC/VHC/H/U/V | MULTIPLEXER | CMOS | 8 mA | TRUE | 80 µA | 5.5 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3.5 mm | NEXPERIA | DHVQFN-16 | compliant | 8542.39.00.01 | ||||||||||
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74AHC157BQ,115
Nexperia
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Check for Price | Yes | Active | 5 V | 21.5 ns | 4 | 2 | 1 | YES | HVQCCN | AHC/VHC/H/U/V | MULTIPLEXER | CMOS | TRUE | 5.5 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR, 7 INCH | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3.5 mm | NEXPERIA | QFN | DHVQFN-16 | 16 | SOT763-1 | compliant | 8542.39.00.01 | Nexperia | ||||||||||
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74AHC157BQ
Nexperia
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Check for Price | Yes | Active | 5 V | 16.5 ns | 10.5 ns | 4 | 2 | 1 | YES | HVQCCN | 50 pF | AHC/VHC/H/U/V | MULTIPLEXER | CMOS | 8 mA | TRUE | 80 µA | 5.5 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3.5 mm | NEXPERIA | HVQCCN, LCC16,.1X.14,20 | compliant | 8542.39.00.01 | 1999-09-24 | |||||||||
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74AHC157BQ-Q100X
Nexperia
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Check for Price | Yes | Active | 5 V | 16.5 ns | 4 | 2 | 1 | YES | HVQCCN | AHC/VHC/H/U/V | MULTIPLEXER | CMOS | TRUE | 5.5 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR, 7 INCH | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3.5 mm | NEXPERIA | QFN | DHVQFN-16 | 16 | SOT763-1 | compliant | Nexperia | |||||||||||
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74AHC157BQ-Q100
NXP Semiconductors
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Check for Price | Transferred | 5 V | 16.5 ns | 4 | 2 | 1 | YES | HVQCCN | AHC/VHC/H/U/V | MULTIPLEXER | CMOS | TRUE | 5.5 V | 2 V | AUTOMOTIVE | R-PQCC-N16 | 125 °C | -40 °C | AEC-Q100 | 16 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 3.5 mm | NXP SEMICONDUCTORS | HVQCCN, | unknown | 8542.39.00.01 |