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Parametric » Logic » Other Logic ICs

Parametric results for: 74aup1g57gx under Other Logic ICs

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Select Parts		Part Number

		74AUP1G57GX NXP Semiconductors
		74AUP1G57GXZ Nexperia
		74AUP1G57GX Nexperia

			Most Relevant					Technical					Compliance		Operating Conditions					Physical								Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Number of Functions	Surface Mount	Package Code	Family	Logic IC Type	Technology	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Manufacturer Package Code	Samacsys Manufacturer

Check for Price

Transferred

1.1 V

1

YES

VSON

AUP/ULP/V

LOGIC CIRCUIT

CMOS

3.6 V

800 mV

AUTOMOTIVE

S-PDSO-N6

125 °C

-40 °C

6

PLASTIC/EPOXY

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

NO LEAD

DUAL

350 µm

800 µm

1 mm

NXP SEMICONDUCTORS

VSON,

unknown

8542.39.00.01

Check for Price

Active

1.1 V

1

YES

HVBCC

AUP/ULP/V

LOGIC CIRCUIT

CMOS

3.6 V

800 mV

AUTOMOTIVE

R-PBCC-B6

e4

1

125 °C

-40 °C

260

30

6

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TR, 7 INCH

NICKEL PALLADIUM GOLD

BUTT

BOTTOM

350 µm

800 µm

1 mm

NEXPERIA

HVBCC,

compliant

SOT1255-2

Nexperia

Check for Price

Yes

Active

1.1 V

1

YES

HVBCC

AUP/ULP/V

LOGIC CIRCUIT

CMOS

3.6 V

800 mV

AUTOMOTIVE

R-PBCC-B6

e4

1

125 °C

-40 °C

260

30

6

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

BUTT

BOTTOM

350 µm

800 µm

1 mm

NEXPERIA

HVBCC,

compliant

8542.39.00.01

Compare

NXP Semiconductors

Check for Price

Transferred

1.1 V

1

YES

VSON

AUP/ULP/V

LOGIC CIRCUIT

CMOS

3.6 V

800 mV

AUTOMOTIVE

S-PDSO-N6

125 °C

-40 °C

6

PLASTIC/EPOXY

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

NO LEAD

DUAL

350 µm

800 µm

1 mm

NXP SEMICONDUCTORS

VSON,

unknown

8542.39.00.01

Nexperia

Check for Price

Active

1.1 V

1

YES

HVBCC

AUP/ULP/V

LOGIC CIRCUIT

CMOS

3.6 V

800 mV

AUTOMOTIVE

R-PBCC-B6

e4

1

125 °C

-40 °C

260

30

6

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TR, 7 INCH

NICKEL PALLADIUM GOLD

BUTT

BOTTOM

350 µm

800 µm

1 mm

NEXPERIA

HVBCC,

compliant

SOT1255-2

Nexperia

Nexperia

Check for Price

Yes

Active

1.1 V

1

YES

HVBCC

AUP/ULP/V

LOGIC CIRCUIT

CMOS

3.6 V

800 mV

AUTOMOTIVE

R-PBCC-B6

e4

1

125 °C

-40 °C

260

30

6

PLASTIC/EPOXY

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

BUTT

BOTTOM

350 µm

800 µm

1 mm

NEXPERIA

HVBCC,

compliant

8542.39.00.01