Parametric results for: 74lvc00abq under Gates

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Manufacturer Part Number: 74lvc00abq
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74LVC00ABQ,115
Nexperia
$0.1626 Yes Active 2.7 V 6.5 ns 4 2 YES HVQCCN LVC/LCX/Z NAND GATE CMOS 3.6 V 1.2 V AUTOMOTIVE R-PQCC-N14 Not Qualified e4 1 125 °C -40 °C 260 30 14 PLASTIC/EPOXY RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TR, 7 INCH NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 1 mm 2.5 mm 3 mm NEXPERIA QFN 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 14 SOT762-1 compliant 8542.39.00.01 Nexperia
74LVC00ABQ,115
NXP Semiconductors
Check for Price Yes Transferred 2.7 V 6.5 ns 5.1 ns 4 2 YES HVQCCN 50 pF NO LVC/LCX/Z NAND GATE CMOS 24 mA 3.6 V 1.2 V AUTOMOTIVE R-PQCC-N14 Not Qualified e4 1 125 °C -40 °C 260 30 14 PLASTIC/EPOXY LCC14,.1X.12,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TR Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm QUAD 1 mm 2.5 mm 3 mm NXP SEMICONDUCTORS QFN 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 14 SOT762-1 compliant 8542.39.00.01
74LVC00ABQ
Nexperia
Check for Price Yes Active 1.8 V 9.7 ns 4 2 YES HVQCCN LVC/LCX/Z NAND GATE CMOS 3.6 V 1.2 V AUTOMOTIVE R-PQCC-N14 e4 1 125 °C -40 °C 260 30 14 PLASTIC/EPOXY RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 1 mm 2.5 mm 3 mm NEXPERIA HVQCCN, compliant 8542.39.00.01 1993-08-01
74LVC00ABQ-Q100
NXP Semiconductors
Check for Price Yes Transferred 3.3 V 9.7 ns 4 2 YES HVQCCN LVC/LCX/Z NAND GATE CMOS 3.6 V 1.65 V AUTOMOTIVE R-PQCC-N14 1 125 °C -40 °C NOT SPECIFIED AEC-Q100 NOT SPECIFIED 14 PLASTIC/EPOXY RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 500 µm QUAD 1 mm 2.5 mm 3 mm NXP SEMICONDUCTORS QFN 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 14 unknown 8542.39.00.01
74LVC00ABQ-Q100
Nexperia
Check for Price Yes Active 1.8 V 9.7 ns 4 2 YES HVQCCN LVC/LCX/Z NAND GATE CMOS 3.6 V 1.2 V AUTOMOTIVE R-PQCC-N14 e4 1 125 °C -40 °C 260 AEC-Q100 30 14 PLASTIC/EPOXY RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NICKEL PALLADIUM GOLD SILVER NO LEAD 500 µm QUAD 1 mm 2.5 mm 3 mm NEXPERIA compliant 8542.39.00.01 2017-02-01
74LVC00ABQ-Q100X
NXP Semiconductors
Check for Price Yes Transferred 3.3 V 9.7 ns 5.1 ns 4 2 YES HVQCCN 50 pF NO LVC/LCX/Z NAND GATE CMOS 24 mA 3.6 V 1.65 V AUTOMOTIVE R-PQCC-N14 Not Qualified 125 °C -40 °C AEC-Q100 14 PLASTIC/EPOXY LCC14,.1X.12,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TR NO LEAD 500 µm QUAD 1 mm 2.5 mm 3 mm NXP SEMICONDUCTORS QFN 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 14 SOT762-1 compliant
74LVC00ABQ
NXP Semiconductors
Check for Price Yes Yes Transferred 2.7 V 6.5 ns 5.5 ns 4 2 YES HVQCCN 50 pF NO LVC/LCX/Z NAND GATE CMOS 24 mA 3.6 V 1.2 V AUTOMOTIVE R-PQCC-N14 Not Qualified e4 1 125 °C -40 °C 260 30 14 PLASTIC/EPOXY LCC14,.1X.12,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TR Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm QUAD 1 mm 2.5 mm 3 mm NXP SEMICONDUCTORS QFN HVQCCN, LCC14,.1X.12,20 14 compliant 8542.39.00.01
74LVC00ABQ-Q100X
Nexperia
Check for Price Yes Active 1.8 V 9.7 ns 4 2 YES HVQCCN LVC/LCX/Z NAND GATE CMOS 3.6 V 1.2 V AUTOMOTIVE R-PQCC-N14 e4 1 125 °C -40 °C 260 AEC-Q100 30 14 PLASTIC/EPOXY RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TR, 7 INCH NICKEL PALLADIUM GOLD SILVER NO LEAD 500 µm QUAD 1 mm 2.5 mm 3 mm NEXPERIA QFN DHVQFN-14 14 SOT762-1 compliant Nexperia 2017-02-01
74LVC00ABQ
Philips Semiconductors
Check for Price Yes Transferred 3.3 V 5.5 ns YES QCCN 50 pF NO NAND GATE CMOS 24 mA AUTOMOTIVE R-PQCC-N14 Not Qualified e4 125 °C -40 °C 14 PLASTIC/EPOXY LCC14,.1X.12,20 RECTANGULAR CHIP CARRIER TR Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm QUAD PHILIPS SEMICONDUCTORS QCCN, LCC14,.1X.12,20 unknown 8542.39.00.01