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Manufacturer Part Number: 74lvc1g157gw
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74LVC1G157GW,125
 Nexperia 		$0.1439 Yes Active 3.3 V 13 ns 1 2 1 YES TSSOP LVC/LCX/Z MULTIPLEXER CMOS TRUE 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR, 7 INCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP SOT-363, 6 PIN 6 SOT363-2 compliant EAR99 8542.39.00.01 Nexperia
74LVC1G157GW-Q100H
 Nexperia 		Check for Price Yes Active 1.8 V 13 ns 1 2 1 YES TSSOP LVC/LCX/Z MULTIPLEXER CMOS TRUE 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 AEC-Q100 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR, 7 INCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP SOT-363, 6 PIN 6 SOT363-2 compliant Nexperia
74LVC1G157GW
 Philips Semiconductors 		Check for Price No Transferred 3.3 V 6.3 ns 1 2 YES TSSOP 50 pF MULTIPLEXER CMOS 24 mA AUTOMOTIVE R-PDSO-G6 Not Qualified e0 125 °C -40 °C 6 PLASTIC/EPOXY TSSOP6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL PHILIPS SEMICONDUCTORS unknown 8542.39.00.01
74LVC1G157GW
 Nexperia 		Check for Price Yes Active 1.8 V 13 ns 1 2 1 YES TSSOP LVC/LCX/Z MULTIPLEXER CMOS TRUE 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA compliant 8542.39.00.01 Nexperia
74LVC1G157GW-Q100
 Nexperia 		Check for Price Yes Active 3.3 V 13 ns 1 2 1 YES TSSOP LVC/LCX/Z MULTIPLEXER CMOS TRUE 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 AEC-Q100 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP, compliant 8542.39.00.01
74LVC1G157GW-Q100H
 NXP Semiconductors 		Check for Price Yes Transferred 1.8 V 13 ns 6.3 ns 1 2 1 YES TSSOP 50 pF LVC/LCX/Z MULTIPLEXER CMOS 24 mA TRUE 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 AEC-Q100 30 6 PLASTIC/EPOXY TSSOP6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS TSSOP PLASTIC, SC-88, SOT-363, 6 PIN 6 SOT363 compliant
74LVC1G157GW
 NXP Semiconductors 		Check for Price Yes Yes Transferred 1.8 V 13 ns 6.3 ns 1 2 1 YES TSSOP 50 pF LVC/LCX/Z MULTIPLEXER CMOS 24 mA TRUE 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY TSSOP6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS SOT-363 PLASTIC, SOT-363, SC-88, 6 PIN 6 compliant 8542.39.00.01 NXP
74LVC1G157GW-Q100
 NXP Semiconductors 		Check for Price Yes Transferred 3.3 V 13 ns 1 2 1 YES TSSOP LVC/LCX/Z MULTIPLEXER CMOS TRUE 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C NOT SPECIFIED AEC-Q100 NOT SPECIFIED 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS SOT-363 TSSOP, 6 unknown 8542.39.00.01
74LVC1G157GW,125
 NXP Semiconductors 		Check for Price Yes Transferred 3.3 V 13 ns 6.3 ns 1 2 1 YES TSSOP 50 pF LVC/LCX/Z MULTIPLEXER CMOS 24 mA TRUE 5.5 V 1.65 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY TSSOP6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS TSSOP PLASTIC, SC-88, SOT-363, 6 PIN 6 SOT363 compliant 8542.39.00.01 NXP