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74LVC1G3157GM-Q10X
Nexperia
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$0.2456 | Active | YES | 195 Ω | 50 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 1 | 40 µA | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 6 | PLASTIC/EPOXY | SON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | NEXPERIA | SON | SON, SOLCC6,.04,20 | 6 | SOT886 | compliant | 8542.39.00.01 | Nexperia | |||||||||||||||
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74LVC1G3157GM
Nexperia
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Check for Price | Yes | Active | 3.3 V | YES | 195 Ω | 22 ns | 11.7 ns | SPDT | CMOS | 5.5 V | 2 | 1 | 42 dB | 40 µA | 5.5 V | 1.65 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PBCC-B6 | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VBCC | SOLCC6,.04,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | TIN | BUTT | 500 µm | BOTTOM | 1.45 mm | 500 µm | 1 mm | NEXPERIA | XSON-6 | compliant | 8542.39.00.01 | Nexperia | 2017-02-01 | |||||||||
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74LVC1G3157GM-Q100
Nexperia
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Check for Price | Yes | Active | SINGLE-ENDED MULTIPLEXER | e4 | 1 | 260 | AEC-Q100 | 30 | NICKEL PALLADIUM GOLD | NEXPERIA | compliant | 8542.39.00.01 | 2019-01-28 | ||||||||||||||||||||||||||||||||||||||||
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74LVC1G3157GM
Philips Semiconductors
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Check for Price | No | Transferred | 3.3 V | YES | 45 Ω | 50 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 1 | 40 µA | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e0 | 125 °C | -40 °C | 6 | PLASTIC/EPOXY | SON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | DUAL | PHILIPS SEMICONDUCTORS | unknown | 8542.39.00.01 | ||||||||||||||||||||||
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74LVC1G3157GM,115
Nexperia
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Check for Price | Yes | Active | 2.7 V | YES | 38 Ω | 6 ns | 5 ns | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 1 | 42 dB | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VSON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | TIN | NO LEAD | 500 µm | DUAL | 1.45 mm | 500 µm | 1 mm | NEXPERIA | SON | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 6 | SOT886 | compliant | 8542.39.00.01 | Nexperia | |||||||||
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74LVC1G3157GM,132
Nexperia
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Check for Price | Yes | Active | 2.7 V | YES | 38 Ω | 6 ns | 5 ns | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 1 | 42 dB | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VSON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | TIN | NO LEAD | 500 µm | DUAL | 1.45 mm | 500 µm | 1 mm | NEXPERIA | SON | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 6 | SOT886 | compliant | 8542.39.00.01 | Nexperia | |||||||||
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74LVC1G3157GM-Q10X
NXP Semiconductors
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Check for Price | Transferred | YES | 195 Ω | 50 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 1 | 40 µA | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | 125 °C | -40 °C | 6 | PLASTIC/EPOXY | SON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE | NO LEAD | 500 µm | DUAL | NXP SEMICONDUCTORS | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||
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74LVC1G3157GM,115
NXP Semiconductors
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Check for Price | Yes | Transferred | 2.7 V | YES | 38 Ω | 6 ns | 5 ns | 50 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 1 | 42 dB | 40 µA | 5.5 V | 1.65 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VSON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Tin (Sn) | NO LEAD | 500 µm | DUAL | 1.45 mm | 500 µm | 1 mm | NXP SEMICONDUCTORS | SON | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 6 | SOT886 | compliant | 8542.39.00.01 | |||||||
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74LVC1G3157GM,132
NXP Semiconductors
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Check for Price | Yes | Transferred | 2.7 V | YES | 38 Ω | 6 ns | 5 ns | 50 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 1 | 42 dB | 40 µA | 5.5 V | 1.65 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VSON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Tin (Sn) | NO LEAD | 500 µm | DUAL | 1.45 mm | 500 µm | 1 mm | NXP SEMICONDUCTORS | SON | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 6 | SOT886 | compliant | 8542.39.00.01 | |||||||
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74LVC1G3157GM
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 2.7 V | YES | 38 Ω | 6 ns | 5 ns | 50 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 1 | 42 dB | 40 µA | 5.5 V | 1.65 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PBCC-N6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VQCCN | SOLCC6,.04,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | Tin (Sn) | NO LEAD | 500 µm | BOTTOM | 1.45 mm | 500 µm | 1 mm | NXP SEMICONDUCTORS | SON | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 6 | compliant | 8542.39.00.01 | NXP |