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74LVC573ABQ,115
Nexperia
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$0.3481 | Yes | Active | 2.7 V | 9.5 ns | 1 | 8 | YES | HVQCCN | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 2 | TRUE | 3.6 V | 1.2 V | AUTOMOTIVE | R-PQCC-N20 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR, 7 INCH | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 4.5 mm | NEXPERIA | QFN | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20 | 20 | SOT764-1 | compliant | 8542.39.00.01 | 1998-07-29 | Nexperia | ||||||||||
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74LVC573ABQ
Philips Semiconductors
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Check for Price | Yes | Transferred | 3.3 V | 8 ns | 1 | 8 | YES | QCCN | 50 pF | 3-STATE | D LATCH | CMOS | 24 mA | AUTOMOTIVE | R-PQCC-N20 | Not Qualified | e4 | 125 °C | -40 °C | 20 | PLASTIC/EPOXY | LCC20,.1X.18,20 | RECTANGULAR | CHIP CARRIER | TR | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | PHILIPS SEMICONDUCTORS | unknown | 8542.39.00.01 | ||||||||||||||||||||||||
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74LVC573ABQ-Q100
NXP Semiconductors
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Check for Price | Yes | Transferred | 3.3 V | 18.4 ns | 1 | 8 | YES | HVQCCN | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 2 | TRUE | 3.6 V | 1.2 V | AUTOMOTIVE | R-PQCC-N20 | 1 | 125 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 20 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 4.5 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 | 20 | unknown | 8542.39.00.01 | ||||||||||||||||
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74LVC573ABQ-Q100X
NXP Semiconductors
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Check for Price | Yes | Transferred | 3.3 V | 18.4 ns | 8 ns | 1 | 8 | YES | HVQCCN | 50 pF | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 24 mA | 2 | TRUE | 3.6 V | 1.2 V | AUTOMOTIVE | R-PQCC-N20 | Not Qualified | 125 °C | -40 °C | AEC-Q100 | 20 | PLASTIC/EPOXY | LCC20,.1X.18,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 4.5 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 | 20 | SOT764-1 | compliant | |||||||||||||
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74LVC573ABQ-Q100
Nexperia
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Check for Price | Yes | Active | 3.3 V | 18.4 ns | 1 | 8 | YES | HVQCCN | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 2 | TRUE | 3.6 V | 1.2 V | AUTOMOTIVE | R-PQCC-N20 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 20 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 4.5 mm | NEXPERIA | HVQCCN, | compliant | 8542.39.00.01 | ||||||||||||||||
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74LVC573ABQ
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 2.7 V | 9.5 ns | 8 ns | 1 | 8 | YES | HVQCCN | 50 pF | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 24 mA | 2 | TRUE | 3.6 V | 1.2 V | AUTOMOTIVE | R-PQCC-N20 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | LCC20,.1X.18,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 4.5 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20 | 20 | compliant | 8542.39.00.01 | NXP | |||||||
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74LVC573ABQ-Q100X
Nexperia
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Check for Price | Yes | Active | 3.3 V | 18.4 ns | 1 | 8 | YES | HVQCCN | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 2 | TRUE | 3.6 V | 1.2 V | AUTOMOTIVE | R-PQCC-N20 | e4 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 20 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR, 7 INCH | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 4.5 mm | NEXPERIA | QFN | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 | 20 | SOT764-1 | compliant | Nexperia | ||||||||||||
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74LVC573ABQ,115
NXP Semiconductors
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Check for Price | Yes | Transferred | 2.7 V | 9.5 ns | 8 ns | 1 | 8 | YES | HVQCCN | 50 pF | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 24 mA | 2 | TRUE | 3.6 V | 1.2 V | AUTOMOTIVE | R-PQCC-N20 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | LCC20,.1X.18,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TR | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 4.5 mm | NXP SEMICONDUCTORS | QFN | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20 | 20 | SOT764-1 | compliant | 8542.39.00.01 | ||||||||
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74LVC573ABQ
Nexperia
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Check for Price | Yes | Active | 1.8 V | 18.4 ns | 1 | 8 | YES | HVQCCN | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | BROADSIDE VERSION OF 373 | 2 | TRUE | 3.6 V | 1.2 V | AUTOMOTIVE | R-PQCC-N20 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 2.5 mm | 4.5 mm | NEXPERIA | compliant | 8542.39.00.01 | 1993-08-01 | Nexperia | EAR99 |