Parametric results for: AD-912) under Digital to Analog Converters
Filter Your Search
1 - 10 of 15 results
|
Select parts from the table below to compare.
Compare
Compare
|
AD9125BCPZ
Analog Devices Inc
|
$37.8340 | No | Yes | Active | 3.3 V | 1 V | -1 V | 16 | YES | D/A CONVERTER | BINARY, 2'S COMPLEMENT BINARY | SERIAL, PARALLEL, WORD | 1 | 20 ns | 490 mA | CMOS | INDUSTRIAL | S-XQCC-N72 | Not Qualified | e3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 72 | UNSPECIFIED | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 10 mm | 1 mm | 10 mm | ANALOG DEVICES INC | QFN | 10 X 10 MM, ROHS COMPLAINT, MO-220VNND-4, LFCSP-72 | 72 | CP-72-7 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||
|
|
AD9121BCPZ
Analog Devices Inc
|
$41.2491 | No | Yes | Active | 3.3 V | 1 V | -1 V | 14 | YES | D/A CONVERTER | 2'S COMPLEMENT | SERIAL | 1 | 20 ns | 495 mA | CMOS | INDUSTRIAL | S-XQCC-N72 | Not Qualified | e3 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 72 | UNSPECIFIED | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 10 mm | 1 mm | 10 mm | ANALOG DEVICES INC | LFCSP-72 | 72 | CP-72-7 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||
|
|
AD9122SCPZ-EP
Analog Devices Inc
|
$51.4006 | No | Yes | Active | 3.3 V | 1 V | -1 V | 16 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 20 ns | CMOS | OTHER | S-XQCC-N72 | e4 | 3 | 105 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 72 | UNSPECIFIED | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 10 mm | 1 mm | 10 mm | ANALOG DEVICES INC | LFCSP-72 | 72 | CP-72-7 | compliant | 3A001.A.2.C | 8542.39.00.01 | Analog Devices | ||||||
|
|
AD9122BCPZ
Analog Devices Inc
|
$61.9159 | No | Yes | Active | 3.3 V | 1 V | -1 V | 16 | YES | D/A CONVERTER | BINARY, 2'S COMPLEMENT BINARY | SERIAL | 1 | 20 ns | CMOS | INDUSTRIAL | S-XQCC-N72 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 72 | UNSPECIFIED | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 10 mm | 1 mm | 10 mm | ANALOG DEVICES INC | QFN | 10 X 10 MM, ROHS COMPLIANT, MO-220VNND-4, LFCSP-72 | 72 | CP-72-7 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||
|
AD9129BBC
Analog Devices Inc
|
$98.0866 | No | No | Active | 1.8 V | 2.5 V | 1.5 V | 14 | YES | D/A CONVERTER | BINARY | PARALLEL, WORD | -1.5 V | 1 | 13 ns | 327 mA | CMOS | INDUSTRIAL | S-PBGA-B160 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 240 | 20 | 160 | PLASTIC/EPOXY | LFBGA | BGA160,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 800 µm | BOTTOM | 12 mm | 1.4 mm | 12 mm | ANALOG DEVICES INC | BGA | CSPBGA-160 | 160 | BC-160-1 | not_compliant | 3A001.A.5.B.2.A | 8542.39.00.01 | Analog Devices | ||
|
|
AD9129BBCZ
Analog Devices Inc
|
$98.5068 | No | Yes | Active | 1.8 V | 2.5 V | 1.5 V | 14 | YES | D/A CONVERTER | BINARY | PARALLEL, WORD | -1.5 V | 1 | 13 ns | 327 mA | CMOS | INDUSTRIAL | S-PBGA-B160 | Not Qualified | e1 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 160 | PLASTIC/EPOXY | LFBGA | BGA160,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 12 mm | 1.4 mm | 12 mm | ANALOG DEVICES INC | BGA | CSPBGA-160 | 160 | BC-160-1 | compliant | 3A001.A.5.B.2.B | 8542.39.00.01 | Analog Devices | ||
|
|
AD9125BCPZRL
Analog Devices Inc
|
Check for Price | No | Yes | Active | 3.3 V | 1 V | -1 V | 16 | YES | D/A CONVERTER | BINARY, 2'S COMPLEMENT BINARY | SERIAL, PARALLEL, WORD | 1 | 20 ns | 490 mA | CMOS | INDUSTRIAL | S-XQCC-N72 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 72 | UNSPECIFIED | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 10 mm | 1 mm | 10 mm | ANALOG DEVICES INC | QFN | 10 X 10 MM, ROHS COMPLAINT, MO-220VNND-4, LFCSP-72 | 72 | CP-72-7 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | |||
|
|
AD9122SCPZ-EP-RL
Analog Devices Inc
|
Check for Price | No | Yes | Active | 3.3 V | 1 V | -1 V | 16 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 20 ns | CMOS | OTHER | S-XQCC-N72 | e4 | 3 | 105 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 72 | UNSPECIFIED | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 10 mm | 1 mm | 10 mm | ANALOG DEVICES INC | LFCSP-72 | 72 | CP-72-7 | compliant | 3A001.A.2.C | 8542.39.00.01 | Analog Devices | ||||||
|
|
AD9125BCPZ
Rochester Electronics LLC
|
Check for Price | Yes | Yes | Active | 3.3 V | 1 V | -1 V | 16 | YES | D/A CONVERTER | BINARY, 2'S COMPLEMENT BINARY | SERIAL, PARALLEL, WORD | 1 | 20 ns | INDUSTRIAL | S-XQCC-N72 | COMMERCIAL | e3 | NOT APPLICABLE | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 72 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 1 mm | 10 mm | ROCHESTER ELECTRONICS INC | QFN | HVQCCN, | 72 | unknown | ||||||||||
|
|
AD9129BBCRL
Analog Devices Inc
|
Check for Price | No | No | Active | 1.8 V | 2.5 V | 1.5 V | 14 | YES | D/A CONVERTER | BINARY | PARALLEL, WORD | -1.5 V | 1 | 13 ns | 327 mA | CMOS | INDUSTRIAL | S-PBGA-B160 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 240 | 20 | 160 | PLASTIC/EPOXY | LFBGA | BGA160,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 800 µm | BOTTOM | 12 mm | 1.4 mm | 12 mm | ANALOG DEVICES INC | BGA | CSPBGA-160 | 160 | BC-160-1 | not_compliant | 3A001.A.5.B.2.B | 8542.39.00.01 | Analog Devices |