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ADG1609BCPZ-REEL7
Analog Devices Inc
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$4.7915 | No | Yes | Active | 5 V | YES | -5 V | 5 Ω | 120 mΩ | 160 ns | 202 ns | 255 mA | DIFFERENTIAL MULTIPLEXER | CMOS | -8 V | -3.3 V | 4 | 1 | 64 dB | 360 µA | 8 V | 3.3 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | ANALOG DEVICES INC | QFN | 3 X 3 MM, ROHS COMPLIANT, MO-220WEED, LFCSP-16 | 16 | CP-16-22 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||
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ADG1609BCPZ-REEL7
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 5 V | YES | -5 V | 5 Ω | 120 mΩ | 160 ns | 202 ns | DIFFERENTIAL MULTIPLEXER | -8 V | -3.3 V | 4 | 1 | 64 dB | 8 V | 3.3 V | AUTOMOTIVE | S-XQCC-N16 | e3 | NOT APPLICABLE | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | ROCHESTER ELECTRONICS INC | QFN | HVQCCN, | 16 | unknown |