Findchips: Parametric Search Results for ADG787BCBZ-REEL


Select Parts		Part Number

		ADG787BCBZ-REEL7 Analog Devices Inc
		ADG787BCBZ-REEL7 Rochester Electronics LLC
		ADG787BCBZ-REEL Analog Devices Inc
		ADG787BCBZ-REEL Rochester Electronics LLC

				Most Relevant						Technical											Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Surface Mount	On-state Resistance-Max (Ron)	On-state Resistance Match-Nom	Switch-on Time-Max	Switch-off Time-Max	Analog IC - Other Type	Technology	Normal Position	Number of Channels	Number of Functions	Off-state Isolation-Nom	Output	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Switching	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$2.9200

Yes

Active

2.7 V

YES

5.75 Ω

70 mΩ

35 ns

7 ns

SPDT

CMOS

63 dB

5.5 V

1.8 V

OTHER

R-PBGA-B10

Not Qualified

85 °C

-25 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2 mm

630 µm

1.5 mm

ANALOG DEVICES INC

BGA

LEAD FREE, WLCSP-10

CB-10-1

compliant

EAR99

8542.39.00.01

Analog Devices

Check for Price

Yes

Active

2.7 V

YES

5.75 Ω

70 mΩ

35 ns

7 ns

SPDT

CMOS

63 dB

5.5 V

1.8 V

OTHER

R-PBGA-B10

85 °C

-25 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2 mm

630 µm

1.5 mm

ROCHESTER ELECTRONICS INC

BGA

VFBGA,

unknown

Check for Price

Yes

Active

2.7 V

YES

5.75 Ω

70 mΩ

30 ns

6 ns

SPDT

CMOS

NO/NC

63 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

OTHER

R-XBGA-B10

Not Qualified

85 °C

-25 °C

260

NOT SPECIFIED

UNSPECIFIED

VFBGA

BGA10,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2 mm

630 µm

1.5 mm

ANALOG DEVICES INC

BGA

LEAD FREE, WLCSP-10

CB-10-1

compliant

EAR99

8542.39.00.01

Analog Devices

Check for Price

Yes

Active

2.7 V

YES

5.75 Ω

70 mΩ

30 ns

6 ns

SPDT

CMOS

63 dB

5.5 V

1.8 V

OTHER

R-XBGA-B10

85 °C

-25 °C

260

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2 mm

630 µm

1.5 mm

ROCHESTER ELECTRONICS INC

BGA

VFBGA,

unknown

Compare

ADG787BCBZ-REEL7

Analog Devices Inc

$2.9200

Yes

Active

2.7 V

YES

5.75 Ω

70 mΩ

35 ns

7 ns

SPDT

CMOS

63 dB

5.5 V

1.8 V

OTHER

R-PBGA-B10

Not Qualified

85 °C

-25 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2 mm

630 µm

1.5 mm

ANALOG DEVICES INC

BGA

LEAD FREE, WLCSP-10

CB-10-1

compliant

EAR99

8542.39.00.01

Analog Devices

ADG787BCBZ-REEL7

Rochester Electronics LLC

Check for Price

Yes

Active

2.7 V

YES

5.75 Ω

70 mΩ

35 ns

7 ns

SPDT

CMOS

63 dB

5.5 V

1.8 V

OTHER

R-PBGA-B10

85 °C

-25 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2 mm

630 µm

1.5 mm

ROCHESTER ELECTRONICS INC

BGA

VFBGA,

unknown

ADG787BCBZ-REEL

Analog Devices Inc

Check for Price

Yes

Active

2.7 V

YES

5.75 Ω

70 mΩ

30 ns

6 ns

SPDT

CMOS

NO/NC

63 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

OTHER

R-XBGA-B10

Not Qualified

85 °C

-25 °C

260

NOT SPECIFIED

UNSPECIFIED

VFBGA

BGA10,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2 mm

630 µm

1.5 mm

ANALOG DEVICES INC

BGA

LEAD FREE, WLCSP-10

CB-10-1

compliant

EAR99

8542.39.00.01

Analog Devices

ADG787BCBZ-REEL

Rochester Electronics LLC

Check for Price

Yes

Active

2.7 V

YES

5.75 Ω

70 mΩ

30 ns

6 ns

SPDT

CMOS

63 dB

5.5 V

1.8 V

OTHER

R-XBGA-B10

85 °C

-25 °C

260

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2 mm

630 µm

1.5 mm

ROCHESTER ELECTRONICS INC

BGA

VFBGA,

unknown

Parametric results for: ADG787BCBZ-REEL under Multiplexers or Switches