Findchips: Parametric Search Results for AM-181

Parametric results for: AM-181 under Microprocessors

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM1810EZWTA3 Texas Instruments
		AM181H National Semiconductor Corporation
		AM181D/883 Texas Instruments
		AM181H/883C National Semiconductor Corporation
		AM181H/883 Texas Instruments
		AM181D/883B Texas Instruments
		AM181D/883C Texas Instruments
		AM1812B1255 Anatech Electronics Inc
		AM181 MACOM
		AM181D/883B National Semiconductor Corporation

				Most Relevant								Technical													Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	RAM (words)	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Number of DMA Channels	Number of Functions	On Chip Data RAM Width	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Analog IC - Other Type	Normal Position	Output	Switching	Average Input Power	Center or Cutoff Frequency (fo/fc)	Filter Type	Height	Input/Output Impedance	Insertion Loss-Max	Mounting Type	Number of Sections-Max	Number of Sections-Min	VSWR

$27.7270

Yes

Active

375 MHz

131072

50 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

310 µA

1.32 V

1.14 V

INDUSTRIAL

S-PBGA-B361

105 °C

-40 °C

260

361

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

16 mm

TEXAS INSTRUMENTS INC

LFBGA,

compliant

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

MILITARY

O-MBCY-W10

Not Qualified

125 °C

-55 °C

METAL

CAN10,.23

ROUND

CYLINDRICAL

Tin/Lead (Sn/Pb)

WIRE

BOTTOM

NATIONAL SEMICONDUCTOR CORP

compliant

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

Check for Price

Obsolete

MILITARY

R-XDIP-T14

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

DIP, DIP14,.3

unknown

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

Check for Price

Obsolete

MILITARY

O-MBCY-W10

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

METAL

CAN10,.23

ROUND

CYLINDRICAL

Tin/Lead (Sn/Pb)

WIRE

BOTTOM

NATIONAL SEMICONDUCTOR CORP

compliant

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

Check for Price

Obsolete

MILITARY

O-MBCY-W10

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

METAL

CAN10,.23

ROUND

CYLINDRICAL

Tin/Lead (Sn/Pb)

WIRE

BOTTOM

NATIONAL SEMICONDUCTOR CORP

, CAN10,.23

unknown

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

Check for Price

Obsolete

MILITARY

R-XDIP-T14

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

DIP, DIP14,.3

unknown

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

Check for Price

Obsolete

MILITARY

R-XDIP-T14

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

DIP, DIP14,.3

unknown

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

Check for Price

Contact Manufacturer

70 °C

-20 °C

17 mm

19 mm

ANATECH ELECTRONICS INC

unknown

1 W

1.8125 GHz

CERAMIC BPF

7 mm

50 OHM

2 dB

SURFACE MOUNT

1.5

Check for Price

Obsolete

M/A-COM INC

unknown

8542.39.00.01

Check for Price

Obsolete

MILITARY

R-XDIP-T14

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

compliant

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

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Compare

AM1810EZWTA3

Texas Instruments

$27.7270

Yes

Active

375 MHz

131072

50 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

310 µA

1.32 V

1.14 V

INDUSTRIAL

S-PBGA-B361

105 °C

-40 °C

260

361

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

16 mm

TEXAS INSTRUMENTS INC

LFBGA,

compliant

3A991.A.2

8542.31.00.01

AM181H

National Semiconductor Corporation

Check for Price

Obsolete

MILITARY

O-MBCY-W10

Not Qualified

125 °C

-55 °C

METAL

CAN10,.23

ROUND

CYLINDRICAL

Tin/Lead (Sn/Pb)

WIRE

BOTTOM

NATIONAL SEMICONDUCTOR CORP

compliant

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

AM181D/883

Texas Instruments

Check for Price

Obsolete

MILITARY

R-XDIP-T14

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

DIP, DIP14,.3

unknown

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

AM181H/883C

National Semiconductor Corporation

Check for Price

Obsolete

MILITARY

O-MBCY-W10

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

METAL

CAN10,.23

ROUND

CYLINDRICAL

Tin/Lead (Sn/Pb)

WIRE

BOTTOM

NATIONAL SEMICONDUCTOR CORP

compliant

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

AM181H/883

Texas Instruments

Check for Price

Obsolete

MILITARY

O-MBCY-W10

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

METAL

CAN10,.23

ROUND

CYLINDRICAL

Tin/Lead (Sn/Pb)

WIRE

BOTTOM

NATIONAL SEMICONDUCTOR CORP

, CAN10,.23

unknown

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

AM181D/883B

Texas Instruments

Check for Price

Obsolete

MILITARY

R-XDIP-T14

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

DIP, DIP14,.3

unknown

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

AM181D/883C

Texas Instruments

Check for Price

Obsolete

MILITARY

R-XDIP-T14

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

DIP, DIP14,.3

unknown

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

AM1812B1255

Anatech Electronics Inc

Check for Price

Contact Manufacturer

70 °C

-20 °C

17 mm

19 mm

ANATECH ELECTRONICS INC

unknown

1 W

1.8125 GHz

CERAMIC BPF

7 mm

50 OHM

2 dB

SURFACE MOUNT

1.5

AM181

MACOM

Check for Price

Obsolete

M/A-COM INC

unknown

8542.39.00.01

AM181D/883B

National Semiconductor Corporation

Check for Price

Obsolete

MILITARY

R-XDIP-T14

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

compliant

8542.39.00.01

SPST

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

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