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Parametric » Power Circuits » Power Management Circuits

Parametric results for: BQ27520YZFT-G3 under Power Management Circuits

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	Part Number

Texas Instruments

			Most Relevant						Technical			Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Obsolete

3.6 V

2.7 V

4.5 V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e1

Not Qualified

1

85 °C

-40 °C

260

30

15

PLASTIC/EPOXY

VFBGA

BGA15,3X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.956 mm

2.61 mm

625 µm

TEXAS INSTRUMENTS INC

BGA

VFBGA, BGA15,3X5,20

15

compliant

EAR99

8542.39.00.01

Texas Instruments

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Texas Instruments

Yes

Obsolete

3.6 V

2.7 V

4.5 V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

R-PBGA-B15

e1

Not Qualified

1

85 °C

-40 °C

260

30

15

PLASTIC/EPOXY

VFBGA

BGA15,3X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.956 mm

2.61 mm

625 µm

TEXAS INSTRUMENTS INC

BGA

VFBGA, BGA15,3X5,20

15

compliant

EAR99

8542.39.00.01

Texas Instruments