Parametric results for: BU-67301B under Serial IO/Communication Controllers

Filter Your Search

1 - 4 of 4 results

|
-
-
Manufacturer Part Number: bu67301b
Select parts from the table below to compare.
Compare
Compare
BU-67301B0T0R-E02
Data Device Corporation
Check for Price Yes Active PCI; USB 0.125 MBps 40 MHz YES 1.8 V SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 CMOS YES MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838 BIPH-LEVEL(MANCHESTER) YES 2 1.95 V 1.65 V S-PBGA-B324 3 324 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 4.7 mm 16 mm 16 mm DATA DEVICE CORP BGA FBGA, 324 compliant 8542.31.00.01
BU-67301B0T0R-102
Data Device Corporation
Check for Price Active PCI; USB 32 16 0.125 MBps 40 MHz YES 1.8 V SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 CMOS 40 MHZ NOMINAL CLOCK AVAILABLE YES SYNC, BYTE; ETHERNET BIPH-LEVEL (MANCHESTER) YES 2 1.95 V 1.65 V MILITARY S-PBGA-B324 125 °C -55 °C 324 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 4.7 mm 16 mm 16 mm DATA DEVICE CORP FBGA, compliant 8542.31.00.01
BU-67301B0T0L-102
Data Device Corporation
Check for Price No Active PCI; USB 32 16 0.125 MBps 40 MHz YES 1.8 V SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 CMOS 40 MHZ NOMINAL CLOCK AVAILABLE YES IEEE1394A BIPH-LEVEL (MANCHESTER) YES 2 1.95 V 1.65 V MILITARY S-PBGA-B324 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 324 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 4.7 mm 16 mm 16 mm DATA DEVICE CORP FBGA, compliant 8542.31.00.01 EAR99
BU-67301B0T0L-E02
Data Device Corporation
Check for Price No Active PCI; USB 0.125 MBps 40 MHz YES 1.8 V SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 CMOS YES MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838 BIPH-LEVEL(MANCHESTER) YES 2 1.95 V 1.65 V S-PBGA-B324 NOT SPECIFIED NOT SPECIFIED 324 PLASTIC/EPOXY FBGA SQUARE GRID ARRAY, FINE PITCH BALL 800 µm BOTTOM 4.7 mm 16 mm 16 mm DATA DEVICE CORP BGA FBGA, 324 compliant 8542.31.00.01