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Parametric results for: CIC21P221 under Other Passive Filters

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Manufacturer Part Number: cic21p221
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CIC21P221NC
 Samsung Semiconductor 		Check for Price Yes Active 2 A 50 mΩ 100 MHz 100 MHz CIC e3 125 °C -55 °C 0805 Chip Bead Ferrite Tape, Paper Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm L2XB1.25XH.9 (mm)/L.0787XB.0492XH.0354 (inch) 1.25 mm SAMSUNG SEMICONDUCTOR INC 0805 compliant SAMSUNG
CIC21P221AC
 Samsung Semiconductor 		Check for Price Yes Active 2 A 50 mΩ 100 MHz 100 MHz CIC e3 125 °C -55 °C 0805 Chip Bead Ferrite Tape, Paper Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm L2XB1.25XH.9 (mm)/L.0787XB.0492XH.0354 (inch) 1.25 mm SAMSUNG SEMICONDUCTOR INC 0805 compliant
CIC21P221NE
 Samsung Electro-Mechanics 		Check for Price Yes Yes Obsolete 2 A 50 mΩ 220 OHM Ω SURFACE MOUNT 100 MHz 100 MHz FERRITE CHIP 1 e3 125 °C -55 °C 0805 Chip Bead 2 TAPE AND REEL Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm 1.25 mm SAMSUNG ELECTRO-MECHANICS 0805 compliant EAR99 8504.50.80.00
CIC21P221AE
 Samsung Electro-Mechanics 		Check for Price Yes Yes Obsolete 2 A 50 mΩ 220 OHM Ω SURFACE MOUNT 100 MHz 100 MHz FERRITE CHIP 1 e3 125 °C -55 °C 0805 Chip Bead 2 TAPE AND REEL Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm 1.25 mm SAMSUNG ELECTRO-MECHANICS 0805 compliant EAR99 8504.50.80.00
CIC21P221NE
 Samsung Semiconductor 		Check for Price Yes Active 2 A 50 mΩ 100 MHz 100 MHz CIC e3 125 °C -55 °C 0805 Chip Bead Ferrite Tape, Embossed Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm L2XB1.25XH.9 (mm)/L.0787XB.0492XH.0354 (inch) 1.25 mm SAMSUNG SEMICONDUCTOR INC 0805 compliant SAMSUNG
CIC21P221BC
 Samsung Electro-Mechanics 		Check for Price Yes Yes Obsolete 2 A 50 mΩ 220 OHM Ω SURFACE MOUNT 100 MHz 100 MHz FERRITE CHIP 1 e3 125 °C -55 °C 0805 Chip Bead 2 TAPE AND REEL Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm 1.25 mm SAMSUNG ELECTRO-MECHANICS 0805 compliant EAR99 8504.50.80.00
CIC21P221AE
 Samsung Semiconductor 		Check for Price Yes Active 2 A 50 mΩ 100 MHz 100 MHz CIC e3 125 °C -55 °C 0805 Chip Bead Ferrite Tape, Embossed Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm L2XB1.25XH.9 (mm)/L.0787XB.0492XH.0354 (inch) 1.25 mm SAMSUNG SEMICONDUCTOR INC 0805 compliant
CIC21P221BE
 Samsung Semiconductor 		Check for Price Yes Active 2 A 50 mΩ 100 MHz 100 MHz CIC e3 125 °C -55 °C 0805 Chip Bead Ferrite Tape, Embossed Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm L2XB1.25XH.9 (mm)/L.0787XB.0492XH.0354 (inch) 1.25 mm SAMSUNG SEMICONDUCTOR INC 0805 compliant
CIC21P221BE
 Samsung Electro-Mechanics 		Check for Price Yes Yes Obsolete 2 A 50 mΩ 220 OHM Ω SURFACE MOUNT 100 MHz 100 MHz FERRITE CHIP 1 e3 125 °C -55 °C 0805 Chip Bead 2 TAPE AND REEL Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm 1.25 mm SAMSUNG ELECTRO-MECHANICS 0805 compliant EAR99 8504.50.80.00
CIC21P221NC
 Samsung Electro-Mechanics 		Check for Price Yes Yes Obsolete 2 A 50 mΩ 220 OHM Ω SURFACE MOUNT 100 MHz 100 MHz FERRITE CHIP 1 e3 125 °C -55 °C 0805 Chip Bead 2 TAPE AND REEL Matte Tin (Sn) - with Nickel (Ni) barrier 900 µm 2 mm 1.25 mm SAMSUNG ELECTRO-MECHANICS 0805 compliant EAR99 8504.50.80.00
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