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HCIS172-29TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 172 | BE-CU | 2.54 mm | IC SOCKET | PGA172 | 1.0 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 16X16 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.6 inch | 1.6 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||
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2CIS179-29GG3M
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 179 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA179 | e4 | 15X15 | GOLD OVER NICKEL | GOLD OVER NICKEL | RND PIN-SKT | POLYBUTYLENE TEREPHTHALATE | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.5 inch | 1.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||||
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CIS149-51TT3M
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 149 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA149 | e0 | 15X15 | TIN LEAD OVER NICKEL | TIN LEAD OVER NICKEL | RND PIN-SKT | POLYBUTYLENE TEREPHTHALATE | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.13 inch | 1.5 inch | 1.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||||
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CIS181-29TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 181 | BRASS | 2.54 mm | IC SOCKET | PGA181 | STANDARD: UL 94V-0 | e0 | 140 °C | -60 °C | 15X15 | NOT SPECIFIED | TIN LEAD OVER NICKEL | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.5 inch | 1.5 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||
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1HCIS179-354TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 179 | BE-CU | 2.54 mm | IC SOCKET | PGA179 | e0 | 260 °C | -60 °C | 15X15 | AU | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.5 inch | 1.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||
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CIS10P260BE
Samsung Semiconductor
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Check for Price | Yes | Active | e3 | 125 °C | -55 °C | SAMSUNG SEMICONDUCTOR INC | compliant | 0603 | 0603 | Chip Bead | 7 mΩ | 100 MHz | 100 MHz | 600 µm | 1.6 mm | Ferrite | Tape, Embossed | L1.6XB.8XH.6 (mm)/L.063XB.0315XH.0236 (inch) | 6 A | CIS | Matte Tin (Sn) - with Nickel (Ni) barrier | 800 µm | |||||||||||||||||||||||
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1CIS116-01TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 116 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA116 | STANDARD: UL 94V-0 | e0 | 140 °C | -60 °C | 11X11 | GOLD OVER NICKEL | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | THERMOPLASTIC POLYESTER | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | not_compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||
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1-HCIS184-51GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 184 | BE-CU | 2.54 mm | IC SOCKET | PGA184 | 1.0 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 14X14 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.13 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||
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HCIS101-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 101 | BE-CU | 2.54 mm | IC SOCKET | PGA101 | 1.0 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 13X13 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.3 inch | 1.3 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||
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HCIS125-04TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 125 | BE-CU | 2.54 mm | IC SOCKET | PGA125 | 1.0 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 13X13 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 1.3 inch | 1.3 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 |