Parametric results for: CIS-1 under Sockets and Chip Carriers

Filter Your Search

1 - 10 of 13,244 results

|
-
-
-
-
-
-
Manufacturer Part Number: cis1
Select parts from the table below to compare.
Compare
Compare
HCIS172-29TG
Advanced Interconnections Corp
Check for Price No Obsolete 172 BE-CU 2.54 mm IC SOCKET PGA172 1.0 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 16X16 AU ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 1.6 inch 1.6 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
2CIS179-29GG3M
Advanced Interconnections Corp
Check for Price No Obsolete 179 BERYLLIUM COPPER ALLOY 2.54 mm IC SOCKET PGA179 e4 15X15 GOLD OVER NICKEL GOLD OVER NICKEL RND PIN-SKT POLYBUTYLENE TEREPHTHALATE 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 1.5 inch 1.5 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
CIS149-51TT3M
Advanced Interconnections Corp
Check for Price No Obsolete 149 BERYLLIUM COPPER ALLOY 2.54 mm IC SOCKET PGA149 e0 15X15 TIN LEAD OVER NICKEL TIN LEAD OVER NICKEL RND PIN-SKT POLYBUTYLENE TEREPHTHALATE 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.13 inch 1.5 inch 1.5 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
CIS181-29TG
Advanced Interconnections Corp
Check for Price No Obsolete 181 BRASS 2.54 mm IC SOCKET PGA181 STANDARD: UL 94V-0 e0 140 °C -60 °C 15X15 NOT SPECIFIED TIN LEAD OVER NICKEL RND PIN-SKT THERMOPLASTIC POLYESTER 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 1.5 inch 1.5 inch ADVANCED INTERCONNECTIONS CORP not_compliant EAR99 8536.69.40.40
1HCIS179-354TG
Advanced Interconnections Corp
Check for Price No Obsolete 179 BE-CU 2.54 mm IC SOCKET PGA179 e0 260 °C -60 °C 15X15 AU Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 1.5 inch 1.5 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
CIS10P260BE
Samsung Semiconductor
Check for Price Yes Active e3 125 °C -55 °C SAMSUNG SEMICONDUCTOR INC compliant 0603 0603 Chip Bead 7 mΩ 100 MHz 100 MHz 600 µm 1.6 mm Ferrite Tape, Embossed L1.6XB.8XH.6 (mm)/L.063XB.0315XH.0236 (inch) 6 A CIS Matte Tin (Sn) - with Nickel (Ni) barrier 800 µm
1CIS116-01TG
Advanced Interconnections Corp
Check for Price No Obsolete 116 BERYLLIUM COPPER ALLOY 2.54 mm IC SOCKET PGA116 STANDARD: UL 94V-0 e0 140 °C -60 °C 11X11 GOLD OVER NICKEL Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT THERMOPLASTIC POLYESTER 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 1.1 inch 1.1 inch ADVANCED INTERCONNECTIONS CORP not_compliant EAR99 8536.69.40.40
1-HCIS184-51GG
Advanced Interconnections Corp
Check for Price No Obsolete 184 BE-CU 2.54 mm IC SOCKET PGA184 1.0 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 14X14 AU ON NI Gold (Au) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.13 inch 1.4 inch 1.4 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCIS101-29TT
Advanced Interconnections Corp
Check for Price No Obsolete 101 BE-CU 2.54 mm IC SOCKET PGA101 1.0 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 13X13 SN-PB ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 1.3 inch 1.3 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCIS125-04TT
Advanced Interconnections Corp
Check for Price No Obsolete 125 BE-CU 2.54 mm IC SOCKET PGA125 1.0 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 13X13 SN-PB ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.12 inch 1.3 inch 1.3 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40