Findchips: Parametric Search Results for CS00

Parametric results for: CS00 under Sockets and Chip Carriers

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		CS009-49GG Advanced Interconnections Corp
		HCS004-29GG Advanced Interconnections Corp
		HCS008-29GG3M Advanced Interconnections Corp
		HCS008-29TG3M Advanced Interconnections Corp
		HCS009-04TG Advanced Interconnections Corp
		CS00032XFSD12XX Wi2Wi
		HCS008-04TT Advanced Interconnections Corp
		CS008-51GT3M Advanced Interconnections Corp
		HCS008-49GGRTV Advanced Interconnections Corp
		CS00032XFSD12RE Wi2Wi

			Most Relevant			Technical			Compliance	Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Number of Contacts	Contact Material	Terminal Pitch	Device Socket Type	Device Type Used On	Additional Feature	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Contact Configuration	Contact Finish Mating	Contact Finish Termination	Contact Style	Housing Material	Mating Contact Pitch	Mounting Style	PCB Contact Pattern	PCB Contact Row Spacing	Termination Type	Body Depth	Body Breadth	Body Length	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Package Description	Aging	Crystal/Resonator Type	Drive Level	Frequency Stability	Frequency Tolerance	Load Capacitance	Mounting Feature	Operating Frequency-Nom	Physical Dimension	Series Resistance	Surface Mount

Check for Price

Obsolete

BERYLLIUM COPPER

2.54 mm

IC SOCKET

PGA189

STANDARD: UL 94V-0

140 °C

-60 °C

GOLD OVER NICKEL

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

THERMOPLASTIC POLYESTER

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

0.3 inch

ADVANCED INTERCONNECTIONS CORP

not_compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

IC SOCKET

PGA4

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

11X11

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

STRAIGHT

RECTANGULAR

SOLDER

0.165 inch

1.1 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BERYLLIUM COPPER ALLOY

IC SOCKET

PGA8

GOLD OVER NICKEL

POLYPHENYLENE SULFIDE

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BERYLLIUM COPPER ALLOY

IC SOCKET

PGA8

GOLD OVER NICKEL

TIN LEAD OVER NICKEL

POLYPHENYLENE SULFIDE

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA9

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

0.3 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Yes

Active

85 °C

-40 °C

WI2WI INC

compliant

8541.60.00.10

GREEN, CERAMIC, SMD, 2 PIN

3 PPM/YEAR

PARALLEL - FUNDAMENTAL

1 µW

0.0122 %

20 ppm

12.5 pF

SURFACE MOUNT

32.768 kHz

L3.3XB1.6XH0.9 (mm)/L0.13XB0.063XH0.035 (inch)

70 kΩ

YES

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA8

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

0.3 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BERYLLIUM COPPER ALLOY

IC SOCKET

PGA8

TIN LEAD OVER NICKEL

GOLD OVER NICKEL

POLYBUTYLENE TEREPHTHALATE

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

IC SOCKET

PGA8

GOLD OVER NICKEL

POLYPHENYLENE SULFIDE

ADVANCED INTERCONNECTIONS CORP

unknown

EAR99

8536.69.40.40

Check for Price

Yes

Obsolete

85 °C

-40 °C

WI2WI INC

compliant

8541.60.00.10

GREEN, CERAMIC PACKAGE-2

3 PPM/YEAR

PARALLEL - FUNDAMENTAL

1 µW

0.1224 %

30 ppm

12.5 pF

SURFACE MOUNT

32.768 kHz

L4.9XB1.8XH1.0 (mm)/L0.193XB0.071XH0.039 (inch)

70 kΩ

YES

1 2 3 4 5 Next

Compare

CS009-49GG

Advanced Interconnections Corp

Check for Price

Obsolete

BERYLLIUM COPPER

2.54 mm

IC SOCKET

PGA189

STANDARD: UL 94V-0

140 °C

-60 °C

GOLD OVER NICKEL

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

THERMOPLASTIC POLYESTER

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

0.3 inch

ADVANCED INTERCONNECTIONS CORP

not_compliant

EAR99

8536.69.40.40

HCS004-29GG

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

IC SOCKET

PGA4

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

11X11

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

STRAIGHT

RECTANGULAR

SOLDER

0.165 inch

1.1 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS008-29GG3M

Advanced Interconnections Corp

Check for Price

Obsolete

BERYLLIUM COPPER ALLOY

IC SOCKET

PGA8

GOLD OVER NICKEL

POLYPHENYLENE SULFIDE

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS008-29TG3M

Advanced Interconnections Corp

Check for Price

Obsolete

BERYLLIUM COPPER ALLOY

IC SOCKET

PGA8

GOLD OVER NICKEL

TIN LEAD OVER NICKEL

POLYPHENYLENE SULFIDE

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS009-04TG

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA9

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

0.3 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

CS00032XFSD12XX

Wi2Wi

Check for Price

Yes

Active

85 °C

-40 °C

WI2WI INC

compliant

8541.60.00.10

GREEN, CERAMIC, SMD, 2 PIN

3 PPM/YEAR

PARALLEL - FUNDAMENTAL

1 µW

0.0122 %

20 ppm

12.5 pF

SURFACE MOUNT

32.768 kHz

L3.3XB1.6XH0.9 (mm)/L0.13XB0.063XH0.035 (inch)

70 kΩ

YES

HCS008-04TT

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA8

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

0.3 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

CS008-51GT3M

Advanced Interconnections Corp

Check for Price

Obsolete

BERYLLIUM COPPER ALLOY

IC SOCKET

PGA8

TIN LEAD OVER NICKEL

GOLD OVER NICKEL

POLYBUTYLENE TEREPHTHALATE

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS008-49GGRTV

Advanced Interconnections Corp

Check for Price

Obsolete

IC SOCKET

PGA8

GOLD OVER NICKEL

POLYPHENYLENE SULFIDE

ADVANCED INTERCONNECTIONS CORP

unknown

EAR99

8536.69.40.40

CS00032XFSD12RE

Wi2Wi

Check for Price

Yes

Obsolete

85 °C

-40 °C

WI2WI INC

compliant

8541.60.00.10

GREEN, CERAMIC PACKAGE-2

3 PPM/YEAR

PARALLEL - FUNDAMENTAL

1 µW

0.1224 %

30 ppm

12.5 pF

SURFACE MOUNT

32.768 kHz

L4.9XB1.8XH1.0 (mm)/L0.193XB0.071XH0.039 (inch)

70 kΩ

YES

1 2 3 4 5 Next