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CY8C4247FNI-BL483T
Cypress Semiconductor
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$4.7447 | Yes | Transferred | 8192 | I2C, I2S, SPI, UART | 36 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE | NO | 25 mA | 5.5 V | 1.8 V | INDUSTRIAL | R-PBGA-B68 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 68 | PLASTIC/EPOXY | VFBGA | BGA68,8X9,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 400 µm | BOTTOM | 550 µm | 3.52 mm | 3.91 mm | CYPRESS SEMICONDUCTOR CORP | WLCSP-68 | compliant | 3A991.A.2 | 8542.31.00.01 | 2016-04-12 | |||
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CY8C4247FNI-BL483T
Infineon Technologies AG
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Check for Price | Yes | End Of Life | 8192 | I2C, I2S, SPI, UART | 36 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE | NO | 25 mA | 5.5 V | 1.8 V | INDUSTRIAL | R-PBGA-B68 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 68 | PLASTIC/EPOXY | VFBGA | BGA68,8X9,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 400 µm | BOTTOM | 550 µm | 3.52 mm | 3.91 mm | INFINEON TECHNOLOGIES AG | WLCSP-68 | compliant | Infineon |