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DS3134
Rochester Electronics LLC
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Check for Price | No | No | Active | YES | CMOS | 1 | 3.3 V | COMMERCIAL | e0 | COMMERCIAL | S-PBGA-B256 | 70 °C | 225 | NOT SPECIFIED | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.34 mm | 27 mm | 27 mm | ROCHESTER ELECTRONICS LLC | BGA | 27 X 27 MM, PLASTIC, BGA-256 | 256 | unknown | NOT SPECIFIED | FRAMER | |||||||||||||||
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DS3134
Dallas Semiconductor
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Check for Price | No | Transferred | YES | CMOS | 1 | 3.3 V | COMMERCIAL | e0 | Not Qualified | S-PBGA-B256 | 70 °C | 256 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | BOTTOM | DALLAS SEMICONDUCTOR | 27 X 27 MM, PLASTIC, BGA-256 | unknown | FRAMER | ||||||||||||||||||||||||||
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DS-313PIN
TE Connectivity
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Check for Price | Transferred | YES | 85 °C | -55 °C | SURFACE MOUNT | 8 | PLASTIC/EPOXY | FL8,.4,100 | TE CONNECTIVITY LTD | unknown | ||||||||||||||||||||||||||||||||||||||
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DS3134
Maxim Integrated Products
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Check for Price | No | Obsolete | YES | CMOS | 1 | 3.3 V | COMMERCIAL | e0 | Not Qualified | S-PBGA-B256 | 70 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.34 mm | 27 mm | 27 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 27 X 27 MM, PLASTIC, BGA-256 | 256 | not_compliant | FRAMER | 8542.39.00.01 | ||||||||||||||||||
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DS3131
Dallas Semiconductor
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Check for Price | No | Transferred | YES | CMOS | 1 | 3.3 V | COMMERCIAL | e0 | Not Qualified | S-PBGA-B256 | 70 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 2.34 mm | 27 mm | 27 mm | DALLAS SEMICONDUCTOR | 27 X 27 MM, PLASTIC, BGA-256 | unknown | TELECOM CIRCUIT | |||||||||||||||||||||
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DS3131+
Maxim Integrated Products
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Check for Price | Yes | Transferred | YES | 1 | 3.3 V | COMMERCIAL | Not Qualified | S-PBGA-B272 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 272 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.34 mm | 27 mm | 27 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | BGA, | 272 | compliant | TELECOM CIRCUIT | 8542.39.00.01 | |||||||||||||||||||
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DS3131DK
Maxim Integrated Products
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Check for Price | No | No | Active | unknown | TELECOM CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||
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DS-313
MACOM
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Check for Price | Active | 50 Ω | 23.98 dBm | 1.8 dB | 1.8 | 2 GHz | SPLITTER | 2 GHz | 10 MHz | 85 °C | -55 °C | COMPONENT | M/A-COM TECHNOLOGY SOLUTIONS INC | FLATPACK, FP-2, 8 PIN | compliant | |||||||||||||||||||||||||||||||||
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DS3131
Maxim Integrated Products
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Check for Price | No | Obsolete | YES | CMOS | 1 | 3.3 V | COMMERCIAL | e0 | Not Qualified | S-PBGA-B256 | 70 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.34 mm | 27 mm | 27 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 27 X 27 MM, PLASTIC, BGA-256 | 256 | not_compliant | TELECOM CIRCUIT | 8542.39.00.01 | ||||||||||||||||||
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DS-313
TE Connectivity
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Check for Price | Transferred | 50 Ω | 23.98 dBm | 1.8 dB | 1.8 | 2 GHz | SPLITTER | 2 GHz | 10 MHz | 85 °C | -55 °C | COMPONENT | TYCO ELECTRONICS M/A-COM | unknown |