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Parametric » Telecommunication Circuits » Network Interfaces

Parametric results for: DS33X81+ under Network Interfaces

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Select Parts		Part Number

		DS33X81+ Maxim Integrated Products
		DS33X81+W Maxim Integrated Products
		DS33X81+ Analog Devices Inc

				Most Relevant	Technical			Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

Yes

Yes

Transferred

1.8 V

SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B256

e1

Not Qualified

3

85 °C

-40 °C

260

30

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

17 mm

1.77 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

BGA,

256

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Yes

Transferred

1.8 V

SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B256

3

85 °C

-40 °C

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

17 mm

17 mm

1.82 mm

MAXIM INTEGRATED PRODUCTS INC

BGA,

compliant

8542.39.00.01

Check for Price

Yes

Not Recommended

1.8 V

SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B256

e1

Not Qualified

3

85 °C

-40 °C

260

30

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

17 mm

17 mm

1.77 mm

256-CSP_BGA-17X17X1.26

256

256-CSP_BGA-17X17X1.26

2008-02-04

Analog Devices

Compare

Telecommunication Circuits

Maxim Integrated Products

Yes

Yes

Transferred

1.8 V

SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B256

e1

Not Qualified

3

85 °C

-40 °C

260

30

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

17 mm

1.77 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

BGA,

256

compliant

EAR99

8542.39.00.01

Maxim Integrated Products

Check for Price

Yes

Yes

Transferred

1.8 V

SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B256

3

85 °C

-40 °C

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

17 mm

17 mm

1.82 mm

MAXIM INTEGRATED PRODUCTS INC

BGA,

compliant

8542.39.00.01

Analog Devices Inc

Check for Price

Yes

Not Recommended

1.8 V

SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B256

e1

Not Qualified

3

85 °C

-40 °C

260

30

256

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

17 mm

17 mm

1.77 mm

256-CSP_BGA-17X17X1.26

256

256-CSP_BGA-17X17X1.26

2008-02-04

Analog Devices