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DSPIC30F2010-20E/MM
Microchip Technology Inc
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$4.4138 | Yes | Yes | Active | 16 | 20 MHz | 4096 | 512 | 512 | 40 MHz | 20 | 5 | YES | 5 V | DIGITAL SIGNAL PROCESSOR, CONTROLLER | CMOS | YES | NO | NO | NO | FIXED POINT | YES | NO | MULTIPLE | YES | 3 | 2 | 8 | 24 | YES | FLASH | 150 mA | 5.5 V | 3 V | AUTOMOTIVE | S-PQCC-N28 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | TS 16949 | 40 | 28 | PLASTIC/EPOXY | HVQCCN | LCC28,.24SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 650 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | QFN | QFN-28 | 28 | compliant | 3A991.A.2 | 8542.31.00.01 | Microchip | ||
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DSPIC30F2010-20E/MMG
Microchip Technology Inc
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Check for Price | Yes | Yes | Contact Manufacturer | 16 | 20 MHz | 512 | 40 MHz | 20 | 3 | YES | 5 V | DIGITAL SIGNAL PROCESSOR, CONTROLLER | CMOS | YES | NO | NO | FLOATING POINT | YES | NO | MULTIPLE | YES | 3 | 8 | 24 | YES | FLASH | 300 mA | 5.5 V | 3 V | AUTOMOTIVE | S-PQCC-N28 | Not Qualified | e3 | 125 °C | -40 °C | TS 16949 | 28 | PLASTIC/EPOXY | HVQCCN | LCC28,.24SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 650 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | QFN | QFN-28 | 28 | compliant | 3A991.A.2 | 8542.31.00.01 | Microchip | |||||||||
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DSPIC30F2010-20E/MMVAO
Microchip Technology Inc
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Check for Price | Yes | Active | 16 | 20 MHz | 512 | 40 MHz | 20 | 5 | YES | 5 V | DIGITAL SIGNAL PROCESSOR, CONTROLLER | CMOS | YES | NO | NO | NO | FIXED POINT | YES | NO | MULTIPLE | YES | 3 | 2 | 8 | 24 | YES | FLASH | 150 mA | 5.5 V | 3 V | AUTOMOTIVE | S-PQCC-N28 | e3 | 125 °C | -40 °C | AEC-Q100; TS 16949 | 28 | PLASTIC/EPOXY | HVQCCN | LCC28,.16SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 550 µm | 4 mm | 4 mm | MICROCHIP TECHNOLOGY INC | QFN-28 | compliant | 3A991.A.2 | 8542.31.00.01 |