Parametric results for: DSPIC33FJXXXGPX0609 under Microcontrollers

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Manufacturer Part Number: dspic33fj
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DSPIC33FJ128GP206T-I/PT
Microchip Technology Inc
$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 64 PLASTIC/EPOXY TFQFP TQFP64,.47SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 1.2 mm 10 mm 10 mm MICROCHIP TECHNOLOGY INC QFP 10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-64 64 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ32MC202T-I/SO
Microchip Technology Inc
$1.0000 Yes Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FLOATING POINT MULTIPLE FLASH 70 mA 3.6 V 3 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 1 85 °C -40 °C 250 40 28 PLASTIC/EPOXY SOP SOP28,.4 RECTANGULAR SMALL OUTLINE MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 17.9 mm MICROCHIP TECHNOLOGY INC SOIC SOP, SOP28,.4 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ256MC710T-I/PF
Microchip Technology Inc
$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 40 100 PLASTIC/EPOXY TQFP TQFP100,.63SQ SQUARE FLATPACK, THIN PROFILE MATTE TIN GULL WING 500 µm QUAD 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC QFP 14 X 14 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-100 100 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ32MC204-E/PT
Microchip Technology Inc
$1.0000 Yes Yes Active 16 40 MHz 2048 40 MHz 35 5 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES NO NO FIXED POINT YES NO MULTIPLE YES 3 1 8 24 YES FLASH 80 mA 3.6 V 3 V AUTOMOTIVE S-PQFP-G44 Not Qualified e3 3 125 °C -40 °C 260 TS 16949 40 44 PLASTIC/EPOXY TQFP TQFP44,.39SQ,31 SQUARE FLATPACK, THIN PROFILE MATTE TIN GULL WING 800 µm QUAD 1.2 mm 10 mm 10 mm MICROCHIP TECHNOLOGY INC QFP TQFP-44 44 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ64GP306T-I/PT
Microchip Technology Inc
$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 64 PLASTIC/EPOXY TFQFP TQFP64,.47SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 1.2 mm 10 mm 10 mm MICROCHIP TECHNOLOGY INC QFP TFQFP, TQFP64,.47SQ 64 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ32GP202T-I/SS
Microchip Technology Inc
$1.0000 Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES MULTIPLE FLASH 80 mA 3.6 V 3 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 2 85 °C -40 °C 260 40 28 PLASTIC/EPOXY SSOP SSOP28,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 2 mm 5.3 mm 10.2 mm MICROCHIP TECHNOLOGY INC SSOP 5.30 MM, LEAD FREE, PLASTIC, SSOP-28 28 compliant 3A991.A.2 8542.31.00.01
DSPIC33FJ128MC706T-I/PT
Microchip Technology Inc
$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 64 PLASTIC/EPOXY TFQFP TQFP64,.47SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 1.2 mm 10 mm 10 mm MICROCHIP TECHNOLOGY INC QFP TFQFP, TQFP64,.47SQ 64 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ12MC202T-I/SO
Microchip Technology Inc
$1.0000 Yes Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE 24 FLASH 90 mA 3.6 V 3 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 1 85 °C -40 °C 260 40 28 PLASTIC/EPOXY SOP SOP28,.4 RECTANGULAR SMALL OUTLINE MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 17.9 mm MICROCHIP TECHNOLOGY INC SOIC 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ32GP204T-I/ML
Microchip Technology Inc
$1.0000 Yes Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES MULTIPLE FLASH 80 mA 3.6 V 3 V INDUSTRIAL S-PQCC-N44 Not Qualified e3 1 85 °C -40 °C 260 40 44 PLASTIC/EPOXY HVQCCN LCC44,.31SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 650 µm QUAD 1 mm 8 mm 8 mm MICROCHIP TECHNOLOGY INC QFN 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44 44 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ06GS101-E/SO
Microchip Technology Inc
$1.0000 Yes Yes Obsolete 16 40 MHz 256 40 MHz 13 4 YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES YES NO NO FIXED POINT YES NO MULTIPLE YES 3 1 8 24 YES FLASH 160 mA 3.6 V 3 V AUTOMOTIVE R-PDSO-G18 Not Qualified e3 1 125 °C -40 °C 260 AEC-Q100; TS 16949 40 18 PLASTIC/EPOXY SOP SOP18,.4 RECTANGULAR SMALL OUTLINE Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 11.55 mm MICROCHIP TECHNOLOGY INC SOIC SOIC-18 18 compliant 3A991.A.2 8542.31.00.01 Microchip