Parametric results for: F/650 under Other Telecom ICs
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F6501AVGK
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | BICMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PBGA-B62 | e3 | 3 | 95 °C | -40 °C | 260 | 62 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN | BALL | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | FCCSP | BGA-62 | 62 | AVG62 | compliant | 5A991.F | 8542.39.00.01 | |||||||||||||||||||
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RF6504TR13
RF Micro Devices Inc
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Check for Price | Transferred | 3.6 V | TELECOM CIRCUIT | 1 | OTHER | R-XBGA-B28 | 70 °C | -30 °C | 28 | UNSPECIFIED | HLGA | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | YES | BUTT | BOTTOM | 5 mm | 5.5 mm | 1.25 mm | RF MICRO DEVICES INC | HLGA, | unknown | 5A991.G | 8517.62.00.50 | |||||||||||||||||||||||||
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F6-50R12KF
Eupec Gmbh & Co Kg
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Check for Price | Obsolete | 125 °C | EUPEC GMBH & CO KG | unknown | EAR99 | 50 A | 1.2 kV | 20 V | 1 | 300 W | 4 V | ||||||||||||||||||||||||||||||||||||||
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RF6504TR7
RF Micro Devices Inc
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Check for Price | Yes | Transferred | 3.6 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B28 | 3 | 70 °C | -30 °C | 28 | UNSPECIFIED | HBCC | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | YES | BUTT | BOTTOM | 5 mm | 5.5 mm | 1.215 mm | RF MICRO DEVICES INC | LGA | HBCC, | 28 | unknown | 5A991.G | 8517.62.00.50 | |||||||||||||||||||||
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RF6504SB
Qorvo
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Check for Price | Obsolete | 3.6 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B28 | 70 °C | -30 °C | 28 | UNSPECIFIED | HBCC | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | YES | BUTT | BOTTOM | 5 mm | 5.5 mm | 1.215 mm | QORVO INC | HBCC, | compliant | 5A991.G | 8517.62.00.50 | Qorvo | ||||||||||||||||||||||||
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F6-50R06KF
Eupec Gmbh & Co Kg
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Check for Price | Obsolete | 125 °C | EUPEC GMBH & CO KG | unknown | EAR99 | 50 A | 600 V | 20 V | 1 | 150 W | 4 V | ||||||||||||||||||||||||||||||||||||||
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F65077-000
TE Connectivity
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Check for Price | No | Active | TE CONNECTIVITY LTD | unknown | TE Connectivity | CONNECTOR ACCESSORY | ALUMINUM ALLOY | 13 | |||||||||||||||||||||||||||||||||||||||||
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F6501AVGK
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Not Recommended | BICMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PBGA-B62 | e3 | 3 | 95 °C | -40 °C | 260 | 62 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN | BALL | BOTTOM | RENESAS ELECTRONICS CORP | FCCSP | 62 | AVG62 | compliant | NLR | 8542390001 | Renesas Electronics | |||||||||||||||||||
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RF6504SR
RF Micro Devices Inc
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Check for Price | Transferred | 3.6 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B28 | 70 °C | -30 °C | 28 | UNSPECIFIED | HBCC | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | YES | BUTT | BOTTOM | 5 mm | 5.5 mm | 1.215 mm | RF MICRO DEVICES INC | LGA | HBCC, | 28 | unknown | 5A991.G | 8517.62.00.50 | |||||||||||||||||||||||
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RF6505SR
RF Micro Devices Inc
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Check for Price | Yes | Yes | Transferred | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | Not Qualified | 2 | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3.5 mm | 3.5 mm | 600 µm | RF MICRO DEVICES INC | QFN | HVQCCN, | 20 | compliant | 5A991.G | 8517.70.00.00 |