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Parametric » Consumer Circuits » Other Consumer ICs

Parametric results for: FAN3850AUC16X under Other Consumer ICs

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Select Parts		Part Number

		FAN3850AUC16X onsemi
		FAN3850AUC16X Fairchild Semiconductor Corporation

				Most Relevant		Technical					Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Package Code	Consumer IC Type	Technology	Number of Functions	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Manufacturer Package Code	Reach Compliance Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

Yes

Yes

Obsolete

VFBGA

CONSUMER CIRCUIT

CMOS

1

3.63 V

1.64 V

OTHER

R-PBGA-B6

Not Qualified

e1

1

85 °C

-30 °C

260

30

6

PLASTIC/EPOXY

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

485 µm

BOTTOM

860 µm

1.26 mm

300 µm

ONSEMI

WLCSP-6

567RF

compliant

8542.39.00.01

onsemi

Check for Price

Yes

Yes

Transferred

VFBGA

CONSUMER CIRCUIT

CMOS

1

3.63 V

1.64 V

OTHER

R-PBGA-B6

Not Qualified

e1

1

85 °C

-30 °C

260

30

6

PLASTIC/EPOXY

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

485 µm

BOTTOM

860 µm

1.26 mm

300 µm

FAIRCHILD SEMICONDUCTOR CORP

1.26 X 0.86 MM, WLCSP-6

6 BALL WLCSP, 2X3 ARRAY, MULTI PITCH, 80UM BUMPS

compliant

8542.39.00.01

CSP

6

Compare

onsemi

Yes

Yes

Obsolete

VFBGA

CONSUMER CIRCUIT

CMOS

1

3.63 V

1.64 V

OTHER

R-PBGA-B6

Not Qualified

e1

1

85 °C

-30 °C

260

30

6

PLASTIC/EPOXY

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

485 µm

BOTTOM

860 µm

1.26 mm

300 µm

ONSEMI

WLCSP-6

567RF

compliant

8542.39.00.01

onsemi

Consumer Circuits

Fairchild Semiconductor Corporation

Check for Price

Yes

Yes

Transferred

VFBGA

CONSUMER CIRCUIT

CMOS

1

3.63 V

1.64 V

OTHER

R-PBGA-B6

Not Qualified

e1

1

85 °C

-30 °C

260

30

6

PLASTIC/EPOXY

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

485 µm

BOTTOM

860 µm

1.26 mm

300 µm

FAIRCHILD SEMICONDUCTOR CORP

1.26 X 0.86 MM, WLCSP-6

6 BALL WLCSP, 2X3 ARRAY, MULTI PITCH, 80UM BUMPS

compliant

8542.39.00.01

CSP

6