Findchips: Parametric Search Results for FPF1205


Select Parts		Part Number

		FPF1205UCX Fairchild Semiconductor Corporation
		FPF1205UCX onsemi

				Most Relevant			Technical						Compliance		Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Surface Mount	On-state Resistance-Max (Ron)	Analog IC - Other Type	Number of Channels	Number of Functions	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

3.3 V

YES

105 mΩ

SPST

4 V

1.2 V

INDUSTRIAL

S-PBGA-B4

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA4,2X2,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

400 µm

BOTTOM

760 µm

539 µm

760 µm

FAIRCHILD SEMICONDUCTOR CORP

CSP

0.76 X 0.76 MM, 0.40 MM PITCH, WLCSP-4

4 BALL WL-CSP, 2X2 ARRAY, 0.4MM PITCH, 250UM BALL, 0.5MM THICKNESS

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Obsolete

3.3 V

YES

105 mΩ

SPST

4 V

1.2 V

INDUSTRIAL

S-PBGA-B4

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA4,2X2,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

400 µm

BOTTOM

760 µm

539 µm

760 µm

ONSEMI

WLCSP-4

567SS

compliant

8542.39.00.01

Compare

FPF1205UCX

Fairchild Semiconductor Corporation

Check for Price

Yes

Transferred

3.3 V

YES

105 mΩ

SPST

4 V

1.2 V

INDUSTRIAL

S-PBGA-B4

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA4,2X2,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

400 µm

BOTTOM

760 µm

539 µm

760 µm

FAIRCHILD SEMICONDUCTOR CORP

CSP

0.76 X 0.76 MM, 0.40 MM PITCH, WLCSP-4

4 BALL WL-CSP, 2X2 ARRAY, 0.4MM PITCH, 250UM BALL, 0.5MM THICKNESS

compliant

EAR99

8542.39.00.01

FPF1205UCX

onsemi

Check for Price

Yes

Obsolete

3.3 V

YES

105 mΩ

SPST

4 V

1.2 V

INDUSTRIAL

S-PBGA-B4

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA4,2X2,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

400 µm

BOTTOM

760 µm

539 µm

760 µm

ONSEMI

WLCSP-4

567SS

compliant

8542.39.00.01

Parametric results for: FPF1205 under Multiplexers or Switches