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FSA5157L6X
onsemi
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$0.3428 | Yes | Active | 2.3 V | YES | 800 mΩ | 120 mΩ | 65 ns | 40 ns | SPDT | CMOS | 1 | 1 | 75 dB | SEPARATE OUTPUT | 4.3 V | 1.65 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XDSO-N6 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | HVSON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.45 mm | 550 µm | 1 mm | ONSEMI | MICROPACK-6 | 127EB | compliant | 8542.39.00.01 | onsemi | ||||||
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FSA5157L6X
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Transferred | 2.3 V | YES | 800 mΩ | 120 mΩ | 65 ns | 40 ns | SPDT | CMOS | 1 | 1 | 75 dB | SEPARATE OUTPUT | 4.3 V | 1.65 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XDSO-N6 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | HVSON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL GOLD | NO LEAD | 500 µm | DUAL | 1.45 mm | 550 µm | 1 mm | FAIRCHILD SEMICONDUCTOR CORP | 1 MM, LEAD FREE, MICROPACK-6 | 6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED) | compliant | 8542.39.00.01 | MICROPAK MLP | 6 | EAR99 | |||
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FSA5157L6X
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 2.3 V | YES | 800 mΩ | 120 mΩ | 65 ns | 40 ns | SPDT | 1 | 1 | 75 dB | 4.3 V | 1.65 V | INDUSTRIAL | R-XDSO-N6 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | NICKEL GOLD | NO LEAD | 500 µm | DUAL | 1.45 mm | 550 µm | 1 mm | ROCHESTER ELECTRONICS INC | VSON, | unknown | SOIC | 6 |