Parametric results for: HCS00MS under Sockets and Chip Carriers

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Manufacturer Part Number: hcs00
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HCS009-51GG
Advanced Interconnections Corp
Check for Price No Obsolete 9 BE-CU 2.54 mm IC SOCKET PGA9 2.5 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 3X3 AU ON NI Gold (Au) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.13 inch 0.3 inch 0.3 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCS008-04GG3M
Advanced Interconnections Corp
Check for Price No Obsolete 8 BERYLLIUM COPPER ALLOY 2.54 mm IC SOCKET PGA8 e4 3X3 GOLD OVER NICKEL GOLD OVER NICKEL RND PIN-SKT POLYPHENYLENE SULFIDE 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.12 inch 0.3 inch 0.3 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCS008-29GT3M
Advanced Interconnections Corp
Check for Price No Obsolete 8 BERYLLIUM COPPER ALLOY 2.54 mm IC SOCKET PGA8 e4 3X3 TIN LEAD OVER NICKEL GOLD OVER NICKEL RND PIN-SKT POLYPHENYLENE SULFIDE 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 0.3 inch 0.3 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCS00DMSR
Intersil Corporation
Check for Price Yes Yes Transferred 2.54 mm e3 125 °C -55 °C INTERSIL CORP compliant 8542.39.00.01 DIP DIP, DIP14,.3 14 HC/UH R-CDIP-T14 50 pF NAND GATE 4 mA 4 2 14 CERAMIC, METAL-SEALED COFIRED DIP DIP14,.3 RECTANGULAR IN-LINE 22 ns 22 ns Not Qualified NO MIL-PRF-38535 Class V 5.08 mm 5.5 V 4.5 V 5 V NO CMOS MILITARY MATTE TIN THROUGH-HOLE DUAL 200k Rad(Si) V 7.62 mm
HCS00HMSR
Intersil Corporation
Check for Price No Yes Transferred e3 125 °C -55 °C INTERSIL CORP compliant 8542.39.00.01 DIE DIE, DIE OR CHIP 14 HC/UH R-XUUC-N14 50 pF NAND GATE 4 mA 4 2 14 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP 22 ns 20 ns Not Qualified NO MIL-PRF-38535 Class V 5.5 V 4.5 V 5 V YES CMOS MILITARY MATTE TIN NO LEAD UPPER 200k Rad(Si) V
HCS00DMSH
Intersil Corporation
Check for Price No Obsolete 1.27 mm e0 125 °C -55 °C INTERSIL CORP not_compliant 8542.39.00.01 SOP, SOP14,.25 R-XDSO-G14 50 pF NAND GATE 4 mA 14 CERAMIC SOP SOP14,.25 RECTANGULAR SMALL OUTLINE 26 ns Not Qualified NO MIL-STD-883 Class S (Modified) 5 V YES CMOS MILITARY Tin/Lead (Sn/Pb) GULL WING DUAL 1M Rad(Si) V
HCS004-49TT
Advanced Interconnections Corp
Check for Price No Obsolete 4 BE-CU 2.54 mm IC SOCKET PGA4 2.5 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 11X11 SN-PB ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.095 inch 1.1 inch 1.1 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
HCS009-01TT
Advanced Interconnections Corp
Check for Price No Obsolete 9 BE-CU 2.54 mm IC SOCKET PGA9 2.5 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 3X3 SN-PB ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RND PIN-SKT GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT RECTANGULAR 100 µm SOLDER 0.165 inch 0.3 inch 0.3 inch ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40
5962R9572401VXX
Renesas Electronics Corporation
Check for Price Active 1.27 mm 125 °C -55 °C RENESAS ELECTRONICS CORP compliant 8542.39.00.01 DFP, HC/UH R-CDFP-F14 NAND GATE 4 2 14 CERAMIC, METAL-SEALED COFIRED DFP FL14,.3 RECTANGULAR FLATPACK 20 ns Not Qualified 2.92 mm 5.5 V 4.5 V 5 V YES CMOS MILITARY FLAT DUAL 6.285 mm 9.525 mm
HCS00KMSH
Intersil Corporation
Check for Price No Obsolete 1.27 mm e0 125 °C -55 °C INTERSIL CORP not_compliant 8542.39.00.01 DFP, FL14,.3 R-XDFP-F14 50 pF NAND GATE 4 mA 14 CERAMIC DFP FL14,.3 RECTANGULAR FLATPACK 26 ns Not Qualified NO 38535V;38534K;883S 5 V YES CMOS MILITARY Tin/Lead (Sn/Pb) FLAT DUAL 200k Rad(Si) V