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HCS009-51GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 9 | BE-CU | 2.54 mm | IC SOCKET | PGA9 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 3X3 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.13 inch | 0.3 inch | 0.3 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||||||||||||
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HCS008-04GG3M
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 8 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA8 | e4 | 3X3 | GOLD OVER NICKEL | GOLD OVER NICKEL | RND PIN-SKT | POLYPHENYLENE SULFIDE | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 0.3 inch | 0.3 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||||||||||||||||||||||||
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HCS008-29GT3M
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 8 | BERYLLIUM COPPER ALLOY | 2.54 mm | IC SOCKET | PGA8 | e4 | 3X3 | TIN LEAD OVER NICKEL | GOLD OVER NICKEL | RND PIN-SKT | POLYPHENYLENE SULFIDE | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 0.3 inch | 0.3 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||||||||||||||||||||||||
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HCS00DMSR
Intersil Corporation
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Check for Price | Yes | Yes | Transferred | 2.54 mm | e3 | 125 °C | -55 °C | INTERSIL CORP | compliant | 8542.39.00.01 | DIP | DIP, DIP14,.3 | 14 | HC/UH | R-CDIP-T14 | 50 pF | NAND GATE | 4 mA | 4 | 2 | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | 22 ns | 22 ns | Not Qualified | NO | MIL-PRF-38535 Class V | 5.08 mm | 5.5 V | 4.5 V | 5 V | NO | CMOS | MILITARY | MATTE TIN | THROUGH-HOLE | DUAL | 200k Rad(Si) V | 7.62 mm | ||||||||||||||||||||||
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HCS00HMSR
Intersil Corporation
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Check for Price | No | Yes | Transferred | e3 | 125 °C | -55 °C | INTERSIL CORP | compliant | 8542.39.00.01 | DIE | DIE, DIE OR CHIP | 14 | HC/UH | R-XUUC-N14 | 50 pF | NAND GATE | 4 mA | 4 | 2 | 14 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | 22 ns | 20 ns | Not Qualified | NO | MIL-PRF-38535 Class V | 5.5 V | 4.5 V | 5 V | YES | CMOS | MILITARY | MATTE TIN | NO LEAD | UPPER | 200k Rad(Si) V | |||||||||||||||||||||||||
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HCS00DMSH
Intersil Corporation
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Check for Price | No | Obsolete | 1.27 mm | e0 | 125 °C | -55 °C | INTERSIL CORP | not_compliant | 8542.39.00.01 | SOP, SOP14,.25 | R-XDSO-G14 | 50 pF | NAND GATE | 4 mA | 14 | CERAMIC | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | 26 ns | Not Qualified | NO | MIL-STD-883 Class S (Modified) | 5 V | YES | CMOS | MILITARY | Tin/Lead (Sn/Pb) | GULL WING | DUAL | 1M Rad(Si) V | |||||||||||||||||||||||||||||||||
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HCS004-49TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 4 | BE-CU | 2.54 mm | IC SOCKET | PGA4 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 11X11 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 1.1 inch | 1.1 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||||||||||||
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HCS009-01TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 9 | BE-CU | 2.54 mm | IC SOCKET | PGA9 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 3X3 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 0.3 inch | 0.3 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||||||||||||
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5962R9572401VXX
Renesas Electronics Corporation
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Check for Price | Active | 1.27 mm | 125 °C | -55 °C | RENESAS ELECTRONICS CORP | compliant | 8542.39.00.01 | DFP, | HC/UH | R-CDFP-F14 | NAND GATE | 4 | 2 | 14 | CERAMIC, METAL-SEALED COFIRED | DFP | FL14,.3 | RECTANGULAR | FLATPACK | 20 ns | Not Qualified | 2.92 mm | 5.5 V | 4.5 V | 5 V | YES | CMOS | MILITARY | FLAT | DUAL | 6.285 mm | 9.525 mm | |||||||||||||||||||||||||||||||||
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HCS00KMSH
Intersil Corporation
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Check for Price | No | Obsolete | 1.27 mm | e0 | 125 °C | -55 °C | INTERSIL CORP | not_compliant | 8542.39.00.01 | DFP, FL14,.3 | R-XDFP-F14 | 50 pF | NAND GATE | 4 mA | 14 | CERAMIC | DFP | FL14,.3 | RECTANGULAR | FLATPACK | 26 ns | Not Qualified | NO | 38535V;38534K;883S | 5 V | YES | CMOS | MILITARY | Tin/Lead (Sn/Pb) | FLAT | DUAL | 200k Rad(Si) V |