Findchips: Parametric Search Results for HCS157MS

Parametric results for: HCS157MS under Multiplexer/Demultiplexers

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		SN74HCS157DR Texas Instruments
		SN74HCS157PWR Texas Instruments
		SN74HCS157QDRQ1 Texas Instruments
		SN74HCS157QPWRQ1 Texas Instruments
		5962R9580501V9A Intersil Corporation
		5962R9580501VEC Harris Semiconductor
		HCS157-04TG Advanced Interconnections Corp
		HCS157-04TT Advanced Interconnections Corp
		HCS157KMSR Renesas Electronics Corporation
		HCS157-51GG Advanced Interconnections Corp

				Most Relevant											Technical									Compliance			Operating Conditions							Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Inputs	Number of Outputs	Surface Mount	Package Code	Load Capacitance (CL)	Schmitt Trigger	Family	Logic IC Type	Technology	Additional Feature	Max I(ol)	Output Polarity	Power Supply Current-Max (ICC)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Total Dose	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Samacsys Manufacturer	Part Package Code	Pin Count	Body Breadth	Body Depth	Body Length	Contact Configuration	Contact Finish Mating	Contact Finish Termination	Contact Material	Contact Style	Device Socket Type	Device Type Used On	Housing Material	Mating Contact Pitch	Mounting Style	Number of Contacts	PCB Contact Pattern	PCB Contact Row Spacing	Termination Type	Manufacturer Package Code

$0.1366

Yes

Active

5 V

55 ns

19 ns

YES

SOP

50 pF

YES

HC/UH

MULTIPLEXER

CMOS

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

SOP16,.25

RECTANGULAR

SMALL OUTLINE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

1.75 mm

3.9 mm

9.9 mm

TEXAS INSTRUMENTS INC

SOP, SOP16,.25

compliant

EAR99

8542.39.00.01

2020-10-18

Texas Instruments

$0.1366

Yes

Active

5 V

55 ns

19 ns

YES

TSSOP

50 pF

YES

HC/UH

MULTIPLEXER

CMOS

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

5 mm

TEXAS INSTRUMENTS INC

TSSOP, TSSOP16,.25

compliant

EAR99

8542.39.00.01

2020-10-18

Texas Instruments

$0.2810

Yes

Active

5 V

55 ns

19 ns

YES

SOP

50 pF

YES

HC/UH

MULTIPLEXER

CMOS

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

SOP16,.25

RECTANGULAR

SMALL OUTLINE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

1.75 mm

3.9 mm

9.9 mm

TEXAS INSTRUMENTS INC

SOP, SOP16,.25

unknown

EAR99

8542.39.00.01

2020-09-07

Texas Instruments

$0.2810

Yes

Active

5 V

55 ns

19 ns

YES

TSSOP

50 pF

YES

HC/UH

MULTIPLEXER

CMOS

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

5 mm

TEXAS INSTRUMENTS INC

TSSOP, TSSOP16,.25

unknown

EAR99

8542.39.00.01

2020-09-07

Texas Instruments

Check for Price

Obsolete

5 V

37 ns

YES

DIE

HC/UH

MULTIPLEXER

CMOS

TRUE

5.5 V

4.5 V

MILITARY

S-XUUC-N16

Not Qualified

125 °C

-55 °C

100k Rad(Si) V

UNSPECIFIED

SQUARE

UNCASED CHIP

TIN LEAD

NO LEAD

UPPER

INTERSIL CORP

DIE,

unknown

8542.39.00.01

DIE

Check for Price

Transferred

5 V

37 ns

DIP

50 pF

HC/UH

MULTIPLEXER

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T16

Not Qualified

125 °C

-55 °C

100k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

GOLD

THROUGH-HOLE

DUAL

HARRIS SEMICONDUCTOR

unknown

8542.39.00.01

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1.7 inch

0.12 inch

1.7 inch

17X17

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA157

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

157

RECTANGULAR

100 µm

SOLDER

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1.7 inch

0.12 inch

1.7 inch

17X17

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA157

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

157

RECTANGULAR

100 µm

SOLDER

Check for Price

Yes

Obsolete

5 V

30 ns

YES

DFP

50 pF

HC/UH

MULTIPLEXER

CMOS

6 mA

TRUE

750 µA

5.5 V

4.5 V

R-CDFP-F16

125 °C

-55 °C

200k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

FL16,.3

RECTANGULAR

FLATPACK

GOLD

FLAT

1.27 mm

DUAL

2.92 mm

6.73 mm

10.41 mm

Renesas Electronics

CFP

K16.A

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1.7 inch

0.13 inch

1.7 inch

17X17

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA157

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

157

RECTANGULAR

100 µm

SOLDER

1 2 3 4 5 Next

Compare

SN74HCS157DR

Texas Instruments

$0.1366

Yes

Active

5 V

55 ns

19 ns

YES

SOP

50 pF

YES

HC/UH

MULTIPLEXER

CMOS

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

SOP16,.25

RECTANGULAR

SMALL OUTLINE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

1.75 mm

3.9 mm

9.9 mm

TEXAS INSTRUMENTS INC

SOP, SOP16,.25

compliant

EAR99

8542.39.00.01

2020-10-18

Texas Instruments

SN74HCS157PWR

Texas Instruments

$0.1366

Yes

Active

5 V

55 ns

19 ns

YES

TSSOP

50 pF

YES

HC/UH

MULTIPLEXER

CMOS

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

5 mm

TEXAS INSTRUMENTS INC

TSSOP, TSSOP16,.25

compliant

EAR99

8542.39.00.01

2020-10-18

Texas Instruments

SN74HCS157QDRQ1

Texas Instruments

$0.2810

Yes

Active

5 V

55 ns

19 ns

YES

SOP

50 pF

YES

HC/UH

MULTIPLEXER

CMOS

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

SOP16,.25

RECTANGULAR

SMALL OUTLINE

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

1.75 mm

3.9 mm

9.9 mm

TEXAS INSTRUMENTS INC

SOP, SOP16,.25

unknown

EAR99

8542.39.00.01

2020-09-07

Texas Instruments

SN74HCS157QPWRQ1

Texas Instruments

$0.2810

Yes

Active

5 V

55 ns

19 ns

YES

TSSOP

50 pF

YES

HC/UH

MULTIPLEXER

CMOS

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G16

125 °C

-40 °C

260

AEC-Q100

PLASTIC/EPOXY

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NICKEL PALLADIUM GOLD

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

5 mm

TEXAS INSTRUMENTS INC

TSSOP, TSSOP16,.25

unknown

EAR99

8542.39.00.01

2020-09-07

Texas Instruments

5962R9580501V9A

Intersil Corporation

Check for Price

Obsolete

5 V

37 ns

YES

DIE

HC/UH

MULTIPLEXER

CMOS

TRUE

5.5 V

4.5 V

MILITARY

S-XUUC-N16

Not Qualified

125 °C

-55 °C

100k Rad(Si) V

UNSPECIFIED

SQUARE

UNCASED CHIP

TIN LEAD

NO LEAD

UPPER

INTERSIL CORP

DIE,

unknown

8542.39.00.01

DIE

5962R9580501VEC

Harris Semiconductor

Check for Price

Transferred

5 V

37 ns

DIP

50 pF

HC/UH

MULTIPLEXER

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T16

Not Qualified

125 °C

-55 °C

100k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

GOLD

THROUGH-HOLE

DUAL

HARRIS SEMICONDUCTOR

unknown

8542.39.00.01

HCS157-04TG

Advanced Interconnections Corp

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1.7 inch

0.12 inch

1.7 inch

17X17

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA157

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

157

RECTANGULAR

100 µm

SOLDER

HCS157-04TT

Advanced Interconnections Corp

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1.7 inch

0.12 inch

1.7 inch

17X17

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA157

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

157

RECTANGULAR

100 µm

SOLDER

HCS157KMSR

Renesas Electronics Corporation

Check for Price

Yes

Obsolete

5 V

30 ns

YES

DFP

50 pF

HC/UH

MULTIPLEXER

CMOS

6 mA

TRUE

750 µA

5.5 V

4.5 V

R-CDFP-F16

125 °C

-55 °C

200k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

FL16,.3

RECTANGULAR

FLATPACK

GOLD

FLAT

1.27 mm

DUAL

2.92 mm

6.73 mm

10.41 mm

Renesas Electronics

CFP

K16.A

HCS157-51GG

Advanced Interconnections Corp

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1.7 inch

0.13 inch

1.7 inch

17X17

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA157

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

157

RECTANGULAR

100 µm

SOLDER

1 2 3 4 5 Next