Parametric results for: HCS200, under Telecom Encryption Circuits
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HCS200T-I/SN
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 1.27 mm | e3 | 85 °C | -40 °C | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | Microchip | R-PDSO-G8 | 4.9 mm | 1 | 1 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | 260 | Not Qualified | TS 16949 | 1.75 mm | 12 mA | 5 V | YES | DATA ENCRYPTION CIRCUIT | INDUSTRIAL | MATTE TIN | GULL WING | DUAL | 30 | 3.9 mm | ||||||||||||||||||||
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HCS200T/SN
Microchip Technology Inc
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$1.4392 | Yes | Yes | Active | 1.27 mm | e3 | 70 °C | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Microchip | R-PDSO-G8 | 4.9 mm | 1 | 1 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | 260 | Not Qualified | 1.75 mm | 5 V | YES | DATA ENCRYPTION CIRCUIT | COMMERCIAL | MATTE TIN | GULL WING | DUAL | 40 | 3.9116 mm | ||||||||||||||||||||||||||
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HCS200-I/SN
Microchip Technology Inc
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$1.5091 | Yes | Yes | Active | 1.27 mm | e3 | 85 °C | -40 °C | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | Microchip | R-PDSO-G8 | 4.9 mm | 1 | 1 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | 260 | Not Qualified | TS 16949 | 1.75 mm | 12 mA | 5 V | YES | DATA ENCRYPTION CIRCUIT | INDUSTRIAL | MATTE TIN | GULL WING | DUAL | 30 | 3.9 mm | ||||||||||||||||||||
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HCS200/SN
Microchip Technology Inc
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$1.5108 | Yes | Yes | Active | 1.27 mm | e3 | 70 °C | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Microchip | R-PDSO-G8 | 4.9 mm | 1 | 1 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | 260 | Not Qualified | 1.75 mm | 5 V | YES | DATA ENCRYPTION CIRCUIT | COMMERCIAL | Matte Tin (Sn) | GULL WING | DUAL | 40 | 3.9116 mm | ||||||||||||||||||||||||||
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HCS200-I/P
Microchip Technology Inc
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$1.5273 | Yes | Yes | Active | 2.54 mm | e3 | 85 °C | -40 °C | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, PLASTIC, DIP-8 | 8 | compliant | EAR99 | 8542.31.00.01 | Microchip | R-PDIP-T8 | 9.46 mm | 1 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Not Qualified | TS 16949 | 4.32 mm | 12 mA | 5 V | NO | DATA ENCRYPTION CIRCUIT | INDUSTRIAL | MATTE TIN | THROUGH-HOLE | DUAL | 7.62 mm | |||||||||||||||||||||||
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HCS200/SN018
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 1.27 mm | e3 | 70 °C | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 8542.39.00.01 | R-PDSO-G8 | 4.9 mm | 1 | 1 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | 260 | Not Qualified | 1.75 mm | 12 mA | 5 V | YES | DATA ENCRYPTION CIRCUIT | COMMERCIAL | Matte Tin (Sn) | GULL WING | DUAL | 40 | 3.9116 mm | |||||||||||||||||||||||||
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HCS200-I/P017
Microchip Technology Inc
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Check for Price | No | Yes | Active | e3 | 85 °C | -40 °C | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, PLASTIC, DIP-8 | 8 | compliant | 8542.39.00.01 | R-PDIP-T8 | 1 | 8 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | Not Qualified | 12 mA | 5 V | NO | DATA ENCRYPTION CIRCUIT | INDUSTRIAL | MATTE TIN | THROUGH-HOLE | DUAL | |||||||||||||||||||||||||||||||
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HCS200-49TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 200 | BE-CU | 2.54 mm | IC SOCKET | PGA200 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 15X15 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 1.5 inch | 1.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||||||
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1-HCS200-49TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 200 | BE-CU | 2.54 mm | IC SOCKET | PGA200 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 15X15 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 1.5 inch | 1.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||||||
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HCS200-344GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 200 | BE-CU | 2.54 mm | IC SOCKET | PGA200 | e4 | 260 °C | -60 °C | 15X15 | AU | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.5 inch | 1.5 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 |