Parametric results for: HSP50216KI under Cellular Telephone Circuits
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HSP50216KIZ
Renesas Electronics Corporation
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$99.7250 | Yes | Obsolete | 3.3 V | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B196 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 196 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 12 mm | 12 mm | 1.5 mm | RENESAS ELECTRONICS CORP | FBGA | LFBGA, | 196 | V196.12X12 | compliant | EAR99 | 8542.39.00.01 | Renesas Electronics | |||
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HSP50216KI
Intersil Corporation
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Check for Price | No | No | Obsolete | 3.3 V | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B196 | Not Qualified | 85 °C | -40 °C | 196 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | INTERSIL CORP | BGA | 12 X 12 MM, PLASTIC, BGA-196 | 196 | not_compliant | 8542.39.00.01 | ||||||||||||
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HSP50216KI
Harris Semiconductor
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Check for Price | Transferred | 3.3 V | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B196 | Not Qualified | 85 °C | -40 °C | 196 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | HARRIS SEMICONDUCTOR | 12 X 12, BGA-196 | unknown | 8542.39.00.01 | ||||||||||||||||
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HSP50216KIZ
Intersil Corporation
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Check for Price | Unknown | 3.3 V | BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B196 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 196 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | 12 mm | 12 mm | 1.5 mm | INTERSIL CORP | BGA | LFBGA, | 196 | compliant | 8542.39.00.01 |