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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: IBM25EMPPC740LEBA366 under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		IBM25EMPPC740LEBA366 IBM
		IBM25EMPPC740LEBA3660 IBM

			Most Relevant							Technical									Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

No

Contact Manufacturer

32

366 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

2.1 V

1.9 V

S-XBGA-B255

Not Qualified

e0

65 °C

-40 °C

255

CERAMIC

BGA

BGA255,16X16,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

IBM MICROELECTRONICS

BGA, BGA255,16X16,50

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

32

366 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

NO

YES

2.1 V

1.9 V

OTHER

S-CBGA-B255

Not Qualified

65 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3 mm

21 mm

21 mm

IBM MICROELECTRONICS

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

255

Compare

IBM25EMPPC740LEBA366

IBM

Check for Price

No

Contact Manufacturer

32

366 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

2.1 V

1.9 V

S-XBGA-B255

Not Qualified

e0

65 °C

-40 °C

255

CERAMIC

BGA

BGA255,16X16,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

IBM MICROELECTRONICS

BGA, BGA255,16X16,50

unknown

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

IBM25EMPPC740LEBA3660

IBM

Check for Price

Obsolete

32

366 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

NO

YES

2.1 V

1.9 V

OTHER

S-CBGA-B255

Not Qualified

65 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3 mm

21 mm

21 mm

IBM MICROELECTRONICS

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

255