Findchips: Parametric Search Results for IDT54FCT273CPB

Parametric results for: IDT54FCT273CPB under FF/Latches

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Select Parts		Part Number

		IDT54FCT273CTLB Integrated Device Technology Inc
		IDT54FCT273CDB Integrated Device Technology Inc
		IDT54FCT273CL Renesas Electronics Corporation
		IDT54FCT273CTL Integrated Device Technology Inc
		IDT54FCT273CL Integrated Device Technology Inc
		IDT54FCT273CEB Integrated Device Technology Inc
		IDT54FCT273CE Renesas Electronics Corporation
		IDT54FCT273CTEB Teledyne e2v
		IDT54FCT273CTE Integrated Device Technology Inc
		IDT54FCT273CTEB Integrated Device Technology Inc

				Most Relevant											Technical								Compliance			Operating Conditions			Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Bits	Surface Mount	Package Code	Max Frequency@Nom-Sup	Load Capacitance (CL)	Trigger Type	Family	Logic IC Type	Technology	Max I(ol)	Output Polarity	Power Supply Current-Max (ICC)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Obsolete

5 V

6.5 ns

YES

QCCN

83.3 MHz

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

5.5 V

4.5 V

MILITARY

S-CQCC-N20

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

LCC20,.35SQ

SQUARE

CHIP CARRIER

TIN LEAD

NO LEAD

1.27 mm

QUAD

2.54 mm

8.89 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

QCCN, LCC20,.35SQ

not_compliant

8542.39.00.01

Check for Price

Obsolete

5 V

6.5 ns

DIP

83.3 MHz

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

5.5 V

4.5 V

MILITARY

R-GDIP-T20

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP20,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

7.62 mm

25.3365 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP20,.3

not_compliant

8542.39.00.01

Check for Price

Contact Manufacturer

5 V

6.5 ns

YES

QCCN

83.3 MHz

50 pF

POSITIVE EDGE

FCT

JBAR-KBAR FLIP-FLOP

CMOS

32 mA

MILITARY

S-XQCC-N20

Not Qualified

125 °C

-55 °C

CERAMIC

LCC20,.35SQ

SQUARE

CHIP CARRIER

TIN LEAD

NO LEAD

1.27 mm

QUAD

RENESAS ELECTRONICS CORP

QCCN, LCC20,.35SQ

compliant

8542.39.00.01

Check for Price

Obsolete

5 V

6.5 ns

YES

QCCN

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-CQCC-N20

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

CHIP CARRIER

TIN LEAD

NO LEAD

1.27 mm

QUAD

1.905 mm

10.8585 mm

7.366 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

QCCN,

unknown

8542.39.00.01

Check for Price

Transferred

5 V

6.5 ns

YES

QCCN

83.3 MHz

50 pF

POSITIVE EDGE

JBAR-KBAR FLIP-FLOP

CMOS

32 mA

MILITARY

S-XQCC-N20

Not Qualified

125 °C

-55 °C

CERAMIC

LCC20,.35SQ

SQUARE

CHIP CARRIER

TIN LEAD

NO LEAD

1.27 mm

QUAD

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

8542.39.00.01

Check for Price

Obsolete

5 V

6.5 ns

YES

DFP

83.3 MHz

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

5.5 V

4.5 V

MILITARY

R-GDFP-F20

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

FL20,.3

RECTANGULAR

FLATPACK

TIN LEAD

FLAT

1.27 mm

DUAL

2.337 mm

6.9215 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

DFP, FL20,.3

not_compliant

8542.39.00.01

Check for Price

Contact Manufacturer

5 V

6.5 ns

YES

DFP

83.3 MHz

50 pF

POSITIVE EDGE

FCT

JBAR-KBAR FLIP-FLOP

CMOS

32 mA

MILITARY

R-XDFP-F20

Not Qualified

125 °C

-55 °C

CERAMIC

FL20,.3

RECTANGULAR

FLATPACK

TIN LEAD

FLAT

1.27 mm

DUAL

RENESAS ELECTRONICS CORP

DFP, FL20,.3

compliant

8542.39.00.01

Check for Price

Active

5 V

6.5 ns

YES

DFP

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

16.3 mA

5.5 V

4.5 V

R-GDFP-F16

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

FL20,.3

RECTANGULAR

FLATPACK

FLAT

1.27 mm

DUAL

2.286 mm

7.239 mm

13.72 mm

E2V TECHNOLOGIES PLC

compliant

8542.39.00.01

Check for Price

Obsolete

5 V

6.5 ns

YES

DFP

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-GDFP-F20

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

FL20,.3

RECTANGULAR

FLATPACK

TIN LEAD

FLAT

1.27 mm

DUAL

2.337 mm

6.9215 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

DFP,

unknown

8542.39.00.01

Check for Price

Obsolete

5 V

6.5 ns

YES

DFP

83.3 MHz

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

5.5 V

4.5 V

MILITARY

R-GDFP-F20

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

FL20,.3

RECTANGULAR

FLATPACK

Tin/Lead (Sn/Pb)

FLAT

1.27 mm

DUAL

2.337 mm

6.9215 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

DFP, FL20,.3

not_compliant

8542.39.00.01

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Compare

IDT54FCT273CTLB

Integrated Device Technology Inc

Check for Price

Obsolete

5 V

6.5 ns

YES

QCCN

83.3 MHz

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

5.5 V

4.5 V

MILITARY

S-CQCC-N20

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

LCC20,.35SQ

SQUARE

CHIP CARRIER

TIN LEAD

NO LEAD

1.27 mm

QUAD

2.54 mm

8.89 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

QCCN, LCC20,.35SQ

not_compliant

8542.39.00.01

IDT54FCT273CDB

Integrated Device Technology Inc

Check for Price

Obsolete

5 V

6.5 ns

DIP

83.3 MHz

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

5.5 V

4.5 V

MILITARY

R-GDIP-T20

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP20,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

7.62 mm

25.3365 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP20,.3

not_compliant

8542.39.00.01

IDT54FCT273CL

Renesas Electronics Corporation

Check for Price

Contact Manufacturer

5 V

6.5 ns

YES

QCCN

83.3 MHz

50 pF

POSITIVE EDGE

FCT

JBAR-KBAR FLIP-FLOP

CMOS

32 mA

MILITARY

S-XQCC-N20

Not Qualified

125 °C

-55 °C

CERAMIC

LCC20,.35SQ

SQUARE

CHIP CARRIER

TIN LEAD

NO LEAD

1.27 mm

QUAD

RENESAS ELECTRONICS CORP

QCCN, LCC20,.35SQ

compliant

8542.39.00.01

IDT54FCT273CTL

Integrated Device Technology Inc

Check for Price

Obsolete

5 V

6.5 ns

YES

QCCN

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-CQCC-N20

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

CHIP CARRIER

TIN LEAD

NO LEAD

1.27 mm

QUAD

1.905 mm

10.8585 mm

7.366 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

QCCN,

unknown

8542.39.00.01

IDT54FCT273CL

Integrated Device Technology Inc

Check for Price

Transferred

5 V

6.5 ns

YES

QCCN

83.3 MHz

50 pF

POSITIVE EDGE

JBAR-KBAR FLIP-FLOP

CMOS

32 mA

MILITARY

S-XQCC-N20

Not Qualified

125 °C

-55 °C

CERAMIC

LCC20,.35SQ

SQUARE

CHIP CARRIER

TIN LEAD

NO LEAD

1.27 mm

QUAD

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

8542.39.00.01

IDT54FCT273CEB

Integrated Device Technology Inc

Check for Price

Obsolete

5 V

6.5 ns

YES

DFP

83.3 MHz

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

5.5 V

4.5 V

MILITARY

R-GDFP-F20

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

FL20,.3

RECTANGULAR

FLATPACK

TIN LEAD

FLAT

1.27 mm

DUAL

2.337 mm

6.9215 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

DFP, FL20,.3

not_compliant

8542.39.00.01

IDT54FCT273CE

Renesas Electronics Corporation

Check for Price

Contact Manufacturer

5 V

6.5 ns

YES

DFP

83.3 MHz

50 pF

POSITIVE EDGE

FCT

JBAR-KBAR FLIP-FLOP

CMOS

32 mA

MILITARY

R-XDFP-F20

Not Qualified

125 °C

-55 °C

CERAMIC

FL20,.3

RECTANGULAR

FLATPACK

TIN LEAD

FLAT

1.27 mm

DUAL

RENESAS ELECTRONICS CORP

DFP, FL20,.3

compliant

8542.39.00.01

IDT54FCT273CTEB

Teledyne e2v

Check for Price

Active

5 V

6.5 ns

YES

DFP

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

16.3 mA

5.5 V

4.5 V

R-GDFP-F16

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

FL20,.3

RECTANGULAR

FLATPACK

FLAT

1.27 mm

DUAL

2.286 mm

7.239 mm

13.72 mm

E2V TECHNOLOGIES PLC

compliant

8542.39.00.01

IDT54FCT273CTE

Integrated Device Technology Inc

Check for Price

Obsolete

5 V

6.5 ns

YES

DFP

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-GDFP-F20

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

FL20,.3

RECTANGULAR

FLATPACK

TIN LEAD

FLAT

1.27 mm

DUAL

2.337 mm

6.9215 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

DFP,

unknown

8542.39.00.01

IDT54FCT273CTEB

Integrated Device Technology Inc

Check for Price

Obsolete

5 V

6.5 ns

YES

DFP

83.3 MHz

50 pF

POSITIVE EDGE

FCT

D FLIP-FLOP

CMOS

32 mA

TRUE

5.5 V

4.5 V

MILITARY

R-GDFP-F20

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

FL20,.3

RECTANGULAR

FLATPACK

Tin/Lead (Sn/Pb)

FLAT

1.27 mm

DUAL

2.337 mm

6.9215 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

DFP, FL20,.3

not_compliant

8542.39.00.01

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