Filter Your Search
1 - 10 of 161 results
|
|
1N4464
Microchip Technology Inc
|
$7.2981 | No | Active | 28 mA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e0 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||||
|
|
JAN1N4464
Microchip Technology Inc
|
$8.1937 | No | Active | 28 mA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
|
|
JANTX1N4464
Microchip Technology Inc
|
$9.3699 | No | Active | 28 mA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
|
|
JANTX1N4464/TR
Microchip Technology Inc
|
$9.4299 | No | Active | 28 mA | 300 nA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY | 4 Ω | 500 Ω | 5.46 V | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | ||||||||
|
|
JAN1N4464US
Microchip Technology Inc
|
$10.7704 | No | Active | 28 mA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
|
|
1N4464US
Microchip Technology Inc
|
$11.8052 | No | Active | 28 mA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | Microchip | |||||||||||||||
|
|
1N4464US/TR
Microchip Technology Inc
|
$11.9023 | No | Active | 53 mA | 1.5 W | 4.7 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 5 % | Not Qualified | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, D-5A, 2 PIN | compliant | EAR99 | 8541.10.00.50 | ||||||||||||
|
|
JANTXV1N4464
Microchip Technology Inc
|
$12.5022 | No | Active | 28 mA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
|
|
JAN1N4464
Semtech Corporation
|
$14.7019 | Transferred | 28 mA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 4 Ω | 4.95 % | Qualified | O-XALF-W2 | MIL-19500/406 | 175 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WIRE | AXIAL | SEMTECH CORP | HERMETIC SEALED, G99, 2 PIN | unknown | SEMTECH | EAR99 | 8541.10.00.50 | 2 | |||||||||||
|
|
JANTX1N4464US
Microchip Technology Inc
|
$15.5331 | No | Active | 28 mA | 1.5 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant |