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JANTX1N4492US.TR
Semtech Corporation
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$1.0000 | Transferred | ZENER DIODE | SEMTECH CORP | unknown | EAR99 | 8541.10.00.50 | 2019-11-13 | ||||||||||||||||||||||||||||||||
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1N4492
Semtech Corporation
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$6.3368 | Transferred | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 500 Ω | 5 % | Not Qualified | O-XALF-W2 | 175 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WIRE | AXIAL | SEMTECH CORP | unknown | EAR99 | 8541.10.00.50 | HERMETIC SEALED, G99, 2 PIN | 2 | ||||||||||
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JAN1N4492
Semtech Corporation
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$6.8544 | Transferred | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 500 Ω | 5 % | Qualified | O-XALF-W2 | MIL-19500/406 | 175 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WIRE | AXIAL | SEMTECH CORP | unknown | EAR99 | 8541.10.00.50 | HERMETIC SEALED, G99, 2 PIN | 2 | |||||||||
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JAN1N4492
Microchip Technology Inc
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$9.8013 | No | Active | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS PACKAGE-2 | |||||||
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1N4492
Microsemi Corporation
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$9.9960 | No | Transferred | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e0 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | unknown | HERMETIC SEALED, GLASS PACKAGE-2 | |||||||||
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1N4492
Microchip Technology Inc
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$10.8967 | No | Active | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e0 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS PACKAGE-2 | |||||||||
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JAN1N4492
Microsemi Corporation
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$11.9255 | No | Transferred | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | unknown | HERMETIC SEALED, GLASS PACKAGE-2 | |||||||
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JANTX1N4492
Microchip Technology Inc
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$12.7072 | No | Active | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS PACKAGE-2 | |||||||
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JAN1N4492US
Microchip Technology Inc
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$14.7883 | No | Active | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS PACKAGE-2 | ||||||||||
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1N4492US
Microsemi Corporation
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$14.9940 | No | Transferred | 1.9 mA | 1.5 W | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | unknown | HERMETIC SEALED, GLASS PACKAGE-2 |